EP 1924394 A2 20080528 - SOLDER ALLOY
Title (en)
SOLDER ALLOY
Title (de)
LÖTLEGIERUNG
Title (fr)
ALLIAGE DE SOUDURE
Publication
Application
Priority
- GB 2006003167 W 20060824
- US 71091705 P 20050824
Abstract (en)
[origin: WO2007023288A2] An alloy suitable for use in a ball grid array, the alloy comprising from 0.15 - 1.5 wt.% copper, from 0.1 - 4 wt.% silver, from 0 - 0.1 wt.% phosphorus, from 0 - 0.1 wt.% germanium, from 0 - 0.1 wt.% gallium, from 0 - 0.3 wt.% of one or more rare earth elements, from 0 - 0.3 wt.% indium, from 0 - 0.3 wt.% magnesium, from 0 - 0.3 wt.% calcium, from 0 - 0.3 wt.% silicon, from 0 - 0.3 wt.% aluminium, from 0 - 0.3 wt.% zinc, from 0 - 1 wt.% antimony, and at least one of the following elements from 0.02 - 0.3 wt% nickel, from 0.008 - 0.2 wt% manganese, from 0.01 - 0.3 wt% cobalt, from 0.005 - 0.3 wt% chromium, from 0.02 - 0.3 wt% iron, and from 0.008 - 0.1 wt% zirconium, and the balance tin, together with unavoidable impurities.
IPC 8 full level
B23K 35/26 (2006.01); C22C 12/00 (2006.01)
CPC (source: EP KR)
B23K 35/26 (2013.01 - KR); B23K 35/262 (2013.01 - EP); C22C 12/00 (2013.01 - KR); C22C 13/00 (2013.01 - EP); H01L 2924/0002 (2013.01 - EP); H05K 3/3436 (2013.01 - EP); H05K 3/3463 (2013.01 - EP)
Citation (search report)
See references of WO 2007023288A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2007023288 A2 20070301; WO 2007023288 A3 20070712; EP 1924394 A2 20080528; JP 2009506203 A 20090212; KR 101339025 B1 20131209; KR 20080106887 A 20081209
DOCDB simple family (application)
GB 2006003167 W 20060824; EP 06779198 A 20060824; JP 2008527511 A 20060824; KR 20087007074 A 20060824