EP 1925023 A1 20080528 - METHOD AND DEVICE FOR DEPOSITING ELECTRONIC COMPONENTS ON A SUBSTRATE
Title (en)
METHOD AND DEVICE FOR DEPOSITING ELECTRONIC COMPONENTS ON A SUBSTRATE
Title (de)
VERFAHREN UND VORRICHTUNG ZUM ABLEGEN VON ELEKTRONISCHEN BAUTEILEN AUF EINEM SUBSTRAT
Title (fr)
PROCEDE ET DISPOSITIF POUR PLACER DES COMPOSANTS ELECTRONIQUES SUR UN SUPPORT
Publication
Application
Priority
EP 2005054632 W 20050916
Abstract (en)
[origin: WO2007033701A1] In a method for depositing electronic components (6) on a substrate (9), the component is transported initially by a primary tool (4) to an intermediate station (10) and from there by a secondary tool (12) to the substrate. The respective actual position of the chip before being picked up at the supply station (7) or at the intermediate station (10) and the position of the substrate at the depositing station (14) are determined by monitoring devices, in particular by cameras (1, 2, 11). Deviations in relation to a predetermined desired position on the substrate can be corrected by relative movement of the tools or possibly of the work stations. The advantage of this method is that any displacement errors when picking up a component can be eliminated by re-measurement at the intermediate station. Furthermore, the secondary tool (12), which oscillates between the intermediate station (10) and the depositing station (14), can be exposed to significantly different operating conditions, for example significantly higher temperatures, without the components at the supply station (17) being put at risk.
IPC 8 full level
H01L 21/683 (2006.01); H01L 21/00 (2006.01); H01L 21/68 (2006.01); H05K 13/04 (2006.01)
CPC (source: EP)
H01L 21/67132 (2013.01); H01L 21/67144 (2013.01); H01L 21/681 (2013.01); H01L 21/6838 (2013.01); H01L 24/75 (2013.01); H01L 2224/32145 (2013.01)
Citation (search report)
See references of WO 2007033701A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2007033701 A1 20070329; EP 1925023 A1 20080528; TW 200729388 A 20070801
DOCDB simple family (application)
EP 2005054632 W 20050916; EP 05787205 A 20050916; TW 95131726 A 20060829