EP 1931594 A4 20130102 - SINTERED POLYCRYSTALLINE DIAMOND MATERIAL WITH EXTREMELY FINE MICROSTRUCTURES
Title (en)
SINTERED POLYCRYSTALLINE DIAMOND MATERIAL WITH EXTREMELY FINE MICROSTRUCTURES
Title (de)
GESINTERTES POLYKRISTALLINES DIAMANTMATERIAL MIT EXTREM FEINEN MIKROSTRUKTUREN
Title (fr)
DIAMANT POLYCRISTALLIN FRITTE A MICROSTRUCTURES EXTREMEMENT FINES
Publication
Application
Priority
- US 2006035801 W 20060914
- US 71722705 P 20050915
- US 53138906 A 20060913
Abstract (en)
[origin: US2007056778A1] A sintered polycrystalline diamond material (PCD) of extremely fine grain size is manufactured by sintering a diamond powder with pre-blended catalyst metal under high pressure/high temperature (HP/HT) processing. The PCD material has an average sintered diamond grain structure of less than 1.0 mum.
IPC 8 full level
C04B 35/52 (2006.01); B01J 3/06 (2006.01); B22F 7/06 (2006.01); C22C 26/00 (2006.01)
CPC (source: EP KR US)
B01J 3/062 (2013.01 - EP US); B22F 7/062 (2013.01 - EP US); C04B 35/52 (2013.01 - EP KR US); C22C 26/00 (2013.01 - EP US); B01J 2203/062 (2013.01 - EP US); B01J 2203/0655 (2013.01 - EP US); B01J 2203/0685 (2013.01 - EP US); B22F 2005/002 (2013.01 - EP US); B22F 2998/00 (2013.01 - EP US); C04B 2235/427 (2013.01 - EP KR US); C04B 2235/5445 (2013.01 - KR); C04B 2235/722 (2013.01 - EP US); C04B 2235/723 (2013.01 - EP US); C04B 2235/782 (2013.01 - EP US); C04B 2235/785 (2013.01 - EP US); C04B 2235/95 (2013.01 - EP US); E21B 10/46 (2013.01 - KR)
C-Set (source: EP US)
Citation (search report)
- [XI] JP H09316587 A 19971209 - SUMITOMO ELECTRIC INDUSTRIES
- [XA] US 2005019114 A1 20050127 - SUNG CHIEN-MIN [TW]
- [XA] WO 2004054943 A1 20040701 - JAPAN SCIENCE & TECH AGENCY [JP], et al
- See references of WO 2007035394A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2007056778 A1 20070315; EP 1931594 A2 20080618; EP 1931594 A4 20130102; JP 2009508798 A 20090305; JP 5289957 B2 20130911; KR 101334048 B1 20131129; KR 20080059569 A 20080630; WO 2007035394 A2 20070329; WO 2007035394 A3 20070607
DOCDB simple family (application)
US 53138906 A 20060913; EP 06803564 A 20060914; JP 2008531314 A 20060914; KR 20087009020 A 20060914; US 2006035801 W 20060914