EP 1938367 A2 20080702 - DEFECTIVITY AND PROCESS CONTROL OF ELECTROLESS DEPOSITION IN MICROELECTRONICS APPLICATIONS
Title (en)
DEFECTIVITY AND PROCESS CONTROL OF ELECTROLESS DEPOSITION IN MICROELECTRONICS APPLICATIONS
Title (de)
DEFEKTIVITÄTS- UND PROZESSSTEUERUNG DER STROMLOSEN ABLAGERUNG IN MIKROELEKTRONIK-ANWENDUNGEN
Title (fr)
DÉFLEXION ET COMMANDE DE PROCESSUS DE DÉPOSITION AUTOCATALYTIQUE DANS DES APPLICATIONS MICROÉLECTRONIQUES
Publication
Application
Priority
- US 2006036479 W 20060919
- US 23091205 A 20050920
- US 24387605 A 20051005
Abstract (en)
[origin: WO2007035731A2] Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
IPC 8 full level
H01L 21/3205 (2006.01)
CPC (source: EP)
C23C 18/32 (2013.01); C23C 18/34 (2013.01); C23C 18/50 (2013.01); H01L 21/288 (2013.01); H01L 21/76849 (2013.01)
Citation (search report)
See references of WO 2007035731A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
WO 2007035731 A2 20070329; WO 2007035731 A3 20090507; EP 1938367 A2 20080702
DOCDB simple family (application)
US 2006036479 W 20060919; EP 06814944 A 20060919