EP 1938373 A2 20080702 - IC COMPONENT COMPRISING A COOLING ARRANGEMENT
Title (en)
IC COMPONENT COMPRISING A COOLING ARRANGEMENT
Title (de)
IC-BAUELEMENT MIT KÜHLANORDNUNG
Title (fr)
COMPOSANT DE CIRCUIT INTEGRE DOTE D'UN SYSTEME DE REFROIDISSEMENT
Publication
Application
Priority
- EP 2006065694 W 20060825
- DE 102005049872 A 20051018
Abstract (en)
[origin: WO2007045520A2] The invention relates to an IC component (2) comprising a cooling arrangement (1) which is embodied as an electronic housing provided with a cooling body (7). According to the invention, the IC component (2) is directly arranged on the cooling body (7) in the electronic housing. The invention advantageously provides a cooling arrangement (1) for IC components (2) that enables the IC component (2) to be efficiently and directly cooled and assembled in a simple manner, without requiring additional components. It is especially suitable for applications in electronic housings in the automobile industry.
IPC 8 full level
H01L 23/367 (2006.01)
CPC (source: EP US)
H01L 23/3677 (2013.01 - EP US); H05K 1/0204 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H05K 3/0061 (2013.01 - EP US); H05K 2201/0373 (2013.01 - EP US); H05K 2201/09054 (2013.01 - EP US); H05K 2201/10689 (2013.01 - EP US)
C-Set (source: EP US)
Citation (search report)
See references of WO 2007045520A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102005049872 A1 20070426; DE 102005049872 B4 20100923; CN 101305459 A 20081112; EP 1938373 A2 20080702; JP 2009512203 A 20090319; US 2008253090 A1 20081016; WO 2007045520 A2 20070426; WO 2007045520 A3 20071018
DOCDB simple family (application)
DE 102005049872 A 20051018; CN 200680038829 A 20060825; EP 06793022 A 20060825; EP 2006065694 W 20060825; JP 2008534954 A 20060825; US 8966806 A 20060825