Global Patent Index - EP 1939233 A1

EP 1939233 A1 20080702 - EPOXY RESIN, EPOXY RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, AND CURED OBJECT OBTAINED THEREFROM

Title (en)

EPOXY RESIN, EPOXY RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, AND CURED OBJECT OBTAINED THEREFROM

Title (de)

EPOXIDHARZ, EPOXIDHARZZUSAMMENSETZUNG, LICHTEMPFINDLICHE HARZZUSAMMENSETZUNG UND DARAUS ERHALTENER GEHÄRTETER GEGENSTAND

Title (fr)

RESINE EPOXY, COMPOSITION DE RESINE EPOXY, COMPOSITION DE RESINE PHOTOSENSIBLE ET OBJET DURCI OBTENU A PARTIR DE CES DERNIERES

Publication

EP 1939233 A1 20080702 (EN)

Application

EP 06811497 A 20061010

Priority

  • JP 2006320184 W 20061010
  • JP 2005302619 A 20051018

Abstract (en)

[PROBLEMS] To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy resins. [MEANS FOR SOLVING PROBLEMS] The epoxy resin is obtained by glycidylating one or more phenol compounds comprising 95% or more 1,1,2,2-tetrakis (hydroxyphenyl) ethane, and is characterized in that in an examination by gel permeation chromatography, the epoxy resin has a tetranucleus-form content of 50 to 90% by area and an octanucleus-form content of at least 5% by area and has a total chlorine content of 5,000 ppm or smaller.

IPC 8 full level

C08G 59/06 (2006.01)

CPC (source: EP KR US)

C08G 59/06 (2013.01 - KR); C08G 59/32 (2013.01 - EP US); C08G 59/40 (2013.01 - KR); C08G 59/42 (2013.01 - EP US); C08L 63/00 (2013.01 - KR)

Citation (search report)

See references of WO 2007046262A1

Designated contracting state (EPC)

DE

DOCDB simple family (publication)

EP 1939233 A1 20080702; CN 101291971 A 20081022; CN 101291971 B 20120718; JP 2013253260 A 20131219; JP 2017082241 A 20170518; JP 6117062 B2 20170419; JP 6212227 B2 20171011; JP WO2007046262 A1 20090423; KR 101345245 B1 20131227; KR 20080063843 A 20080707; TW 200720312 A 20070601; TW I400261 B 20130701; US 2009131607 A1 20090521; US 7884172 B2 20110208; WO 2007046262 A1 20070426

DOCDB simple family (application)

EP 06811497 A 20061010; CN 200680038692 A 20061010; JP 2006320184 W 20061010; JP 2007540928 A 20061010; JP 2013190263 A 20130913; JP 2017009498 A 20170123; KR 20087011613 A 20080515; TW 95138263 A 20061017; US 8328406 A 20061010