EP 1945728 A1 20080723 - LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
Title (en)
LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
Title (de)
SCHMELZKLEBSTOFF MIT NIEDRIGER ANWENDUNGSTEMPERATUR
Title (fr)
ADHESIF THERMOFUSIBLE A BASSE TEMPERATURE D'APPLICATION
Publication
Application
Priority
- US 2006039471 W 20061010
- US 25125605 A 20051014
Abstract (en)
[origin: US2007088116A1] A hot melt adhesive composition, comprising a blend of components including about 10% to about 40% by weight of an elastomeric block copolymer, preferably styrene-isoprene-styrene (SIS) or styrene-butadiene-styrene (SBS), about 15% to about 70% by weight of a first midblock tackifying resin having a softening point of at least about 110° C. and having an aromatic content of at least about 1.5% by weight; about 0 to 55% of second midblock tackifying resin, about 5% to about 35% by weight of a plasticizer; and about 0% to about 20% by weight of an end block resin having a softening point lower than 125° C.; wherein the components total 100% by weight of the composition, the viscosity of the composition is equal to or less than about 20,000 mPa.s at 120° C., and is applied at a temperature lower that 150° C. and initial bond retention of the composition on elastic strands is at least about 60%. Also, the elastic modulus G' of the composition is higher than about 5000 Pa, the vicous modules G'' is higher than about 50 Pa, and the tan delta value is between about 0.5 and about 60. Laminates, especially those used in disposable soft goods, and methods of making such laminates are also described. The adhesive composition and/or laminate may be used in making a variety of end products such as a disposable diaper, a sanitary napkin, a bed pad, a bandage, a surgical drape, a tape, a label, a plastic sheet, a nonwoven sheet, a paper sheet, a cardboard, a book, a filter, or a package.
IPC 8 full level
C09J 153/02 (2006.01); A61L 15/58 (2006.01)
CPC (source: EP US)
A61L 15/585 (2013.01 - EP US); C09J 153/02 (2013.01 - EP US); C08L 2666/02 (2013.01 - EP US)
Citation (search report)
See references of WO 2007047232A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2007088116 A1 20070419; AT E533824 T1 20111215; AU 2006304041 A1 20070426; BR PI0617276 A2 20130226; BR PI0617276 B1 20170207; BR PI0617276 B8 20210727; CA 2625528 A1 20070426; CA 2625528 C 20130730; CN 101331203 A 20081224; CN 101331203 B 20120425; EP 1945728 A1 20080723; EP 1945728 B1 20111116; ES 2380505 T3 20120514; JP 2009511713 A 20090319; JP 5339911 B2 20131113; US 2009264580 A1 20091022; US 8129464 B2 20120306; WO 2007047232 A1 20070426
DOCDB simple family (application)
US 25125605 A 20051014; AT 06825664 T 20061010; AU 2006304041 A 20061010; BR PI0617276 A 20061010; CA 2625528 A 20061010; CN 200680047007 A 20061010; EP 06825664 A 20061010; ES 06825664 T 20061010; JP 2008535613 A 20061010; US 2006039471 W 20061010; US 47694009 A 20090602