EP 1948388 A1 20080730 - LEAD-FREE SOLDER ALLOY
Title (en)
LEAD-FREE SOLDER ALLOY
Title (de)
BLEIFREIE LÖTLEGIERUNG
Title (fr)
ALLIAGE DE SOUDAGE NE CONTENANT PAS DE PLOMB
Publication
Application
Priority
- GB 2006003948 W 20061023
- GB 0521636 A 20051024
Abstract (en)
[origin: GB2431412A] An alloy suitable for use in tinning or the manufacture of heat exchangers, the alloy comprising (by weight): ```1.5 - 6 wt.% copper, ```0.08 - 1.5 wt.% bismuth, ```0 - 1.5 wt.% silver, ```0 - 0.02 wt.% phosphorus, ```0 - 0.02 wt.% germanium, ```0 - 0.15 wt% of indium, ```0 - 0.3 wt% of silicon, ```0 - 0.2 wt% of zirconium, ```one or both of 0.02 - 0.2 wt.% nickel and/or ```0.01 - 0.2 wt.% cobalt, ```and the balance tin, together with unavoidable impurities.
IPC 8 full level
B23K 35/26 (2006.01); C22C 13/00 (2006.01)
CPC (source: EP GB)
B23K 35/262 (2013.01 - GB); C22C 13/00 (2013.01 - EP)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
GB 0521636 D0 20051130; GB 2431412 A 20070425; GB 2431412 B 20091007; EP 1948388 A1 20080730; WO 2007049025 A1 20070503
DOCDB simple family (application)
GB 0521636 A 20051024; EP 06794884 A 20061023; GB 2006003948 W 20061023