EP 1949430 A1 20080730 - TREATING A GERMANIUM LAYER BONDED TO A SUBSTRATE
Title (en)
TREATING A GERMANIUM LAYER BONDED TO A SUBSTRATE
Title (de)
BEHANDLUNG EINER AN EIN SUBSTRAT GEBONDETEN GERMANIUMSCHICHT
Title (fr)
TRAITEMENT D'UNE COUCHE DE GERMANIUM COLLEE A UN SUBSTRAT
Publication
Application
Priority
- FR 2006002332 W 20061017
- FR 0510636 A 20051019
Abstract (en)
[origin: WO2007045759A1] The invention concerns a method for treating a structure comprising a thin Ge layer on a substrate, said layer having been previously bonded to the substrate, the method including a treatment for improving the electrical properties of the layer and/or of the interface of the Ge layer with the underlying layer. The invention is characterized in that said treatment is a heat treatment implemented at a temperature ranging between 5000C and 6000C for a maximum of 3 hours. The invention also concerns a method for producing a structure comprising a Ge layer, the method including bonding a donor substrate comprising at least in its upper part a thin Ge layer and a receiver substrate, characterized in that it includes the following steps: (a) bonding the donor substrate to the receiver substrate such that the Ge layer is located in the neighborhood of the bonding interface; (b) eliminating part of the donor substrate not including the Ge layer; (c) treating the structure comprising the receiver substrate and the Ge layer in accordance with the treatment method.
IPC 8 full level
H01L 21/762 (2006.01)
CPC (source: EP KR US)
H01L 21/20 (2013.01 - KR); H01L 21/324 (2013.01 - KR); H01L 21/76254 (2013.01 - EP US)
Citation (search report)
See references of WO 2007045759A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
FR 2892230 A1 20070420; FR 2892230 B1 20080704; CN 101292342 A 20081022; EP 1949430 A1 20080730; JP 2009513009 A 20090326; KR 20080068870 A 20080724; US 2008268615 A1 20081030; WO 2007045759 A1 20070426
DOCDB simple family (application)
FR 0510636 A 20051019; CN 200680038884 A 20061017; EP 06820227 A 20061017; FR 2006002332 W 20061017; JP 2008536082 A 20061017; KR 20087011858 A 20080516; US 9031806 A 20061017