EP 1951927 A4 20101208 - FABRICATION OF ELECTRODE STRUCTURES BY THERMAL SPRAYING
Title (en)
FABRICATION OF ELECTRODE STRUCTURES BY THERMAL SPRAYING
Title (de)
HERSTELLUNG VON ELEKTRODENSTRUKTUREN DURCH THERMISCHES SPRITZEN
Title (fr)
FABRICATION DE STRUCTURES D'ELECTRODE PAR PROJECTION A CHAUD
Publication
Application
Priority
- CA 2006001770 W 20061027
- US 73038005 P 20051027
Abstract (en)
[origin: WO2007048253A1] A method for the rapid production of electrode structures such as Cu-SDC anodes for use in direct oxidation solid oxide fuel cells involves co-depositing a copper-containing material and a ceramic by plasma spraying to form a coating on a substrate. Layers of CuO-SDC have been co-deposited by air plasma spraying, followed by in-situ reduction of the CuO to Cu in the anodes. Materials having catalytic properties, such as cobalt, may also be incorporated in the structures. Controlled compositional or microstructural gradients may be applied to optimize the microstructure and composition of the coatings.
IPC 8 full level
C23C 4/12 (2006.01); B22F 1/00 (2006.01); C23C 4/06 (2006.01); H01M 4/04 (2006.01); H01M 4/88 (2006.01); H01M 8/12 (2006.01)
CPC (source: EP US)
B22F 3/115 (2013.01 - EP US); C22C 32/0021 (2013.01 - EP US); C23C 4/06 (2013.01 - EP US); C23C 4/08 (2013.01 - EP US); C23C 4/11 (2016.01 - EP US); H01M 4/8621 (2013.01 - EP US); H01M 4/886 (2013.01 - EP US); H01M 4/9025 (2013.01 - EP US); H01M 4/9066 (2013.01 - EP US); B22F 2999/00 (2013.01 - EP US); H01M 4/9016 (2013.01 - EP US); H01M 2008/1293 (2013.01 - EP US); Y02E 60/50 (2013.01 - EP)
Citation (search report)
- [XI] US 2005058883 A1 20050317 - RUKA ROSWELL J [US], et al
- [XI] JP H0292875 A 19900403 - IWATE PREF GOV
- [I] WO 03010865 A1 20030206 - ITN ENERGY SYSTEMS INC [US]
- [I] WO 02087002 A1 20021031 - HEWLETT PACKARD CO [US]
- [I] WO 2005064717 A1 20050714 - PIRELLI & C SPA [IT], et al
- [X] JP 2004083964 A 20040318 - HITACHI LTD, et al
- [XP] WO 2006052280 A2 20060518 - STRUTT PETER R [US], et al
- See references of WO 2007048253A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2007048253 A1 20070503; CA 2627356 A1 20070503; EP 1951927 A1 20080806; EP 1951927 A4 20101208; US 2008280189 A1 20081113
DOCDB simple family (application)
CA 2006001770 W 20061027; CA 2627356 A 20061027; EP 06790901 A 20061027; US 9193606 A 20061027