EP 1952682 A4 20100106 - METHOD AND APPARATUS FOR ESTABLISHING OPTIMAL THERMAL CONTACT BETWEEN OPPOSING SURFACES
Title (en)
METHOD AND APPARATUS FOR ESTABLISHING OPTIMAL THERMAL CONTACT BETWEEN OPPOSING SURFACES
Title (de)
VERFAHREN UND VORRICHTUNG ZUR HERSTELLUNG EINES OPTIMALEN THERMISCHEN KONTAKTS ZWISCHEN GEGENÜBERLIEGENDEN OBERFLÄCHEN
Title (fr)
PROCEDE ET APPAREIL POUR ETABLIR UN CONTACT THERMIQUE OPTIMAL ENTRE DES SURFACES OPPOSEES
Publication
Application
Priority
- US 2006042562 W 20061031
- US 26526405 A 20051101
Abstract (en)
[origin: US2007097648A1] To achieve optimal thermal contact between opposing surfaces, it is necessary to align such surfaces so that maximum contact is achieved. In a semiconductor package, it is necessary to align the surface of a semiconductor integrated circuit (IC) and a heat sink surface, where the heat sink contains a nano-composite wire structure. By using a self-aligned structure that forces the alignment of the IC surface and the heat sink, maximum thermal contact between the two surfaces is achieved. The self-alignment of a pressure measurement device for same is also disclosed.
IPC 8 full level
H05K 7/20 (2006.01); H01L 23/40 (2006.01); H01L 23/433 (2006.01)
CPC (source: EP US)
H01L 23/4006 (2013.01 - EP US); H01L 23/433 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
Citation (search report)
- [XY] US 6169659 B1 20010102 - WHEATON CHRIS [US]
- [XY] DE 2927860 A1 19810129 - SIEMENS AG
- [Y] US 2005224220 A1 20051013 - LI JUN [US], et al
- [XY] US 3805122 A 19740416 - VOGEL X
- [XY] US 5010949 A 19910430 - DEHAINE GERARD [FR]
- [XY] DE 2839077 A1 19800320 - SIEMENS AG
- [XY] US 5648889 A 19970715 - BOSLI HANS LUDWIG [CH]
- [Y] GB 2402555 A 20041208 - HEWLETT PACKARD DEVELOPMENT CO [US]
- [Y] US 2005231918 A1 20051020 - GOLDMANN LEWIS S [US]
- [Y] WO 9307659 A1 19930415 - IFAX CORP [US]
- [Y] US 5847452 A 19981208 - TANTOUSH MOHAMMAD A [US]
- [Y] US 5109317 A 19920428 - MIYAMOTO MITSUO [JP], et al
- [Y] US 6490161 B1 20021203 - JOHNSON ERIC ARTHUR [US]
- See references of WO 2007053649A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2007097648 A1 20070503; EP 1952682 A2 20080806; EP 1952682 A4 20100106; TW 200741435 A 20071101; TW I316170 B 20091021; WO 2007053649 A2 20070510; WO 2007053649 A3 20090514
DOCDB simple family (application)
US 26526405 A 20051101; EP 06827228 A 20061031; TW 95140497 A 20061101; US 2006042562 W 20061031