EP 1958241 A2 20080820 - METHOD FOR DRY CHEMICAL TREATMENT OF SUBSTRATES AND USE THEREOF
Title (en)
METHOD FOR DRY CHEMICAL TREATMENT OF SUBSTRATES AND USE THEREOF
Title (de)
VERFAHREN ZUR TROCKENCHEMISCHEN BEHANDLUNG VON SUBSTRATEN, SOWIE DESSEN VERWENDUNG
Title (fr)
PROCEDE POUR REALISER UN TRAITEMENT CHIMIQUE A SEC DE SUBSTRATS, ET SON UTILISATION
Publication
Application
Priority
- EP 2006011716 W 20061206
- DE 102005058713 A 20051208
Abstract (en)
[origin: WO2007065658A2] The invention relates to a method for dry chemical treatment of substrates, selected from the group comprising silicon, ceramics, glass and quartz glass, wherein the substrate is treated in a heated reaction chamber with a gas containing hydrogen chloride as etching agent and a substrate produced as above. The invention further relates to uses of said method.
IPC 8 full level
H01L 21/02 (2006.01); H01L 21/205 (2006.01); H01L 21/306 (2006.01); H01L 21/322 (2006.01); H01L 21/324 (2006.01)
CPC (source: EP US)
C03C 15/00 (2013.01 - EP US); C04B 41/009 (2013.01 - EP US); C04B 41/5346 (2013.01 - EP US); C04B 41/91 (2013.01 - EP US); H01L 21/02046 (2013.01 - EP US); H01L 21/3221 (2013.01 - EP US); H01L 31/1804 (2013.01 - EP US); Y02E 10/547 (2013.01 - US); Y02P 70/50 (2015.11 - EP US); Y10T 428/24479 (2015.01 - EP US)
Citation (search report)
See references of WO 2007065658A2
Citation (examination)
- JP 2003100693 A 20030404 - TOSHIBA CERAMICS CO
- EP 0617456 A2 19940928 - GI CORP [US]
- JP H11121441 A 19990430 - FUJI ELECTRIC CO LTD
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102005058713 A1 20070614; DE 102005058713 B4 20090402; CN 101326619 A 20081217; EP 1958241 A2 20080820; JP 2009518834 A 20090507; JP 5133257 B2 20130130; US 2009197049 A1 20090806; US 8569175 B2 20131029; WO 2007065658 A2 20070614; WO 2007065658 A3 20071108
DOCDB simple family (application)
DE 102005058713 A 20051208; CN 200680045865 A 20061206; EP 06829345 A 20061206; EP 2006011716 W 20061206; JP 2008543722 A 20061206; US 9627106 A 20061206