EP 1958252 A2 20080820 - LOW-RESISTANCE VOID-FREE CONTACTS FOR EEPROM DEVICES
Title (en)
LOW-RESISTANCE VOID-FREE CONTACTS FOR EEPROM DEVICES
Title (de)
LÜCKENLOSE KONTAKTE MIT GERINGEM WIDERSTAND FÜR EEPROM-GERÄTE
Title (fr)
CONTACTS SANS VIDE À FAIBLE RÉSISTANCE
Publication
Application
Priority
- US 2006061351 W 20061129
- US 29602205 A 20051206
- US 29623505 A 20051206
Abstract (en)
[origin: WO2007067860A2] A plug is formed by depositing a first material to partially fill an opening, leaving an unfilled portion with a lower aspect ratio than the original opening. A second material is then deposited to fill the remaining portion of the opening. The first material has good filling characteristics but has higher resistivity than the second material. The second material has low resistivity to give the plug low resistance.
IPC 8 full level
H01L 21/8247 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 27/115 (2006.01)
CPC (source: EP)
H01L 21/76877 (2013.01); H10B 41/30 (2023.02); H10B 41/35 (2023.02); H10B 69/00 (2023.02); G11C 16/0483 (2013.01); H10B 43/30 (2023.02)
Citation (search report)
See references of WO 2007067860A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2007067860 A2 20070614; WO 2007067860 A3 20070907; EP 1958252 A2 20080820; TW 200739827 A 20071016; TW I332252 B 20101021
DOCDB simple family (application)
US 2006061351 W 20061129; EP 06848514 A 20061129; TW 95145418 A 20061206