EP 1959493 A4 20100310 - PROCESS FOR PRODUCING ELECTRONIC PART, PROCESS FOR PRODUCING HEAT CONDUCTING MEMBER, AND METHOD OF MOUNTING HEAT CONDUCTING MEMBER FOR ELECTRONIC PART
Title (en)
PROCESS FOR PRODUCING ELECTRONIC PART, PROCESS FOR PRODUCING HEAT CONDUCTING MEMBER, AND METHOD OF MOUNTING HEAT CONDUCTING MEMBER FOR ELECTRONIC PART
Title (de)
PROZESS ZUM HERSTELLEN EINES ELEKTRONISCHEN TEILS, PROZESS ZUM HERSTELLEN EINES WÄRMELEITGLIEDES UND VERFAHERN ZUM ANBRINGEN EINES WÄRMELEITGLIEDES FÜR EIN ELEKTRONISCHES TEIL
Title (fr)
PROCEDE POUR LA PRODUCTION DE PIECE ELECTRONIQUE, PROCEDE POUR LA PRODUCTION D'ELEMENT CONDUCTEUR DE CHALEUR, ET PROCEDE DE MONTAGE D'ELEMENT CONDUCTEUR DE CHALEUR POUR PIECE ELECTRONIQUE
Publication
Application
Priority
JP 2005022551 W 20051208
Abstract (en)
[origin: EP1959493A1] A solid bonding material (22) is placed on an electronic component (16). A heat conductive member (21) is superposed on the surface of the bonding material (22). A thermosetting adhesive (27, 28) of fluid state is interposed between the heat conductive member (21) and a substrate (15). The heat conductive member (21) is supported on the surface of the solid bonding material (22). The thickness of the bonding material (22) is maintained. When the bonding material (22) melts after the thermosetting adhesive (27, 28) has cured, the heat conductive member (21) is supported on the cured thermosetting adhesive (27, 28). The heat conductive member (21) is thus reliably prevented from a downward movement irrespective of the melting of the bonding material (22). The cured bonding material (22) is prevented from suffering from a reduction in the thickness. The thickness of the cured bonding material (22) can accurately be controlled based on the thickness of the solid bonding material (22).
IPC 8 full level
H01L 23/02 (2006.01); H01L 23/36 (2006.01)
CPC (source: EP KR US)
H01L 21/50 (2013.01 - EP US); H01L 23/02 (2013.01 - KR); H01L 23/055 (2013.01 - EP US); H01L 23/42 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US); H01L 2224/73253 (2013.01 - EP US); H01L 2924/00011 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/16195 (2013.01 - EP US); Y10T 156/1089 (2015.01 - EP US)
Citation (search report)
- [A] US 5219794 A 19930615 - SATOH TOSHIHIKO [JP], et al
- [A] WO 2004105129 A1 20041202 - FUJITSU LTD [JP], et al
- [A] US 5217922 A 19930608 - AKASAKI HIROSHI [JP], et al
- [A] US 6870258 B1 20050322 - TOO SEAH SUN [US]
- [A] AMENDOLA A ET AL: "COOLING STRUCTURE FOR AN INTEGRATED CIRCUIT MODULE", IBM TECHNICAL DISCLOSURE BULLETIN, INTERNATIONAL BUSINESS MACHINES CORP. (THORNWOOD), US, vol. 23, no. 2, 1 July 1980 (1980-07-01), pages 602, XP002191051, ISSN: 0018-8689
- See references of WO 2007066401A1
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 1959493 A1 20080820; EP 1959493 A4 20100310; EP 1959493 B1 20120208; CN 100593238 C 20100303; CN 101326637 A 20081217; JP 4757880 B2 20110824; JP WO2007066401 A1 20090514; KR 100962100 B1 20100609; KR 20080073743 A 20080811; US 2008295957 A1 20081204; US 8709197 B2 20140429; WO 2007066401 A1 20070614
DOCDB simple family (application)
EP 05814186 A 20051208; CN 200580052267 A 20051208; JP 2005022551 W 20051208; JP 2007549001 A 20051208; KR 20087014131 A 20051208; US 15568008 A 20080606