EP 1966814 A4 20090318 - WIRE-BASED FLAT PANEL DISPLAYS
Title (en)
WIRE-BASED FLAT PANEL DISPLAYS
Title (de)
FLACHBILDSCHIRME AUF DRAHTBASIS
Title (fr)
ECRANS PLATS A FIL
Publication
Application
Priority
- US 2006061872 W 20061211
- US 74944605 P 20051212
- US 75970406 P 20060118
- US 82714606 P 20060927
- US 82715206 P 20060927
- US 82717006 P 20060927
- US 60909306 A 20061211
- US 60913106 A 20061211
- US 60922006 A 20061211
Abstract (en)
[origin: WO2007070778A2] An effective method to create very large electronic displays forms the structure using fiber or tube arrays or electroded sheets containing wire electrodes. The electroded sheets are formed by embedding wire electrodes into the surface of a polymer substrate and electrically connecting a patterned transparent conductive electrode lines to the wires. The wire electrodes are used to carry the bulk of the current and the transparent conductive electrode is used to spread the charge or voltage from the wire electrode across the line of pixels. In most display applications, the electroded surface of the electroded sheet has to be flattened. The electroded sheets may be used to form many different types of displays.
IPC 8 full level
H01J 11/18 (2012.01); H01J 11/24 (2012.01); H01J 11/34 (2012.01); H01J 17/49 (2006.01)
CPC (source: EP)
H01J 9/02 (2013.01); H01J 11/18 (2013.01); H01J 11/24 (2013.01); H01J 11/34 (2013.01)
Citation (search report)
- [XY] US 2001009352 A1 20010726 - MOORE CHAD BYRON [US]
- [Y] US 2003134506 A1 20030717 - KIM DAE-IL [US], et al
- [A] US 5984747 A 19991116 - BHAGAVATULA VENKATA A [US], et al
- [A] US 6570339 B1 20030527 - MOORE CHAD BYRON [US]
- [A] JP 2000085068 A 20000328 - NITTO DENKO CORP
- See references of WO 2007070778A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2007070778 A2 20070621; WO 2007070778 A3 20080626; EP 1966814 A2 20080910; EP 1966814 A4 20090318; JP 2009519564 A 20090514
DOCDB simple family (application)
US 2006061872 W 20061211; EP 06846554 A 20061211; JP 2008544676 A 20061211