EP 1967596 A1 20080910 - Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
Title (en)
Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
Title (de)
Cu-Ni-Si-basiertes Kupferlegierungsfolienmaterial und Herstellungsverfahren dafür
Title (fr)
Matériau de feuille d'alliage de cuivre à base de Cu-Ni-Si et son procédé de fabrication
Publication
Application
Priority
- JP 2007032623 A 20070213
- JP 2007326559 A 20071218
Abstract (en)
This invention provides a copper alloy sheet material containing, in mass%, Ni: 0.7% - 4.2% and Si: 0.2% - 1.0%, optionally containing one or more of Sn: 1.2% or less, Zn: 2.0% or less, Mg: 1.0% or less, Co: 2.0% or less, and Fe: 1.0% or less, and a total of 3% or less of one or more of Cr, B, P, Zr, Ti, Mn and V, the balance being substantially Cu, and having a crystal orientation satisfying Expression (1): I 420 / I 0 420 > 1.0 where I{420} is the x-ray diffraction intensity from the {420} crystal plane in the sheet plane of the copper alloy sheet material and I 0 {420 } is the x-ray diffraction intensity from the {420} crystal plane of standard pure copper powder. The copper alloy sheet material has highly improved strength, post-notching bending workability, and stress relaxation resistance property.
IPC 8 full level
CPC (source: EP)
C22C 1/06 (2013.01); C22C 9/06 (2013.01); C22F 1/08 (2013.01)
Citation (applicant)
DE 4115998 A1 19921119 - DIEHL GMBH & CO [DE]
Citation (search report)
- [A] DE 4115998 A1 19921119 - DIEHL GMBH & CO [DE]
- [A] US 5463247 A 19951031 - FUTATSUKA RENSEI [JP], et al
- [A] US 2002127133 A1 20020912 - USAMI TAKAYUKI [JP], et al
- [A] EP 0949343 A1 19991013 - KOBE STEEL LTD [JP]
- [A] US 2002119071 A1 20020829 - USAMI TAKAYUKI [JP], et al
- [A] US 2004079456 A1 20040429 - MANDIGO FRANK N [US], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
DOCDB simple family (application)
EP 08002634 A 20080213