Global Patent Index - EP 1967596 A1

EP 1967596 A1 20080910 - Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same

Title (en)

Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same

Title (de)

Cu-Ni-Si-basiertes Kupferlegierungsfolienmaterial und Herstellungsverfahren dafür

Title (fr)

Matériau de feuille d'alliage de cuivre à base de Cu-Ni-Si et son procédé de fabrication

Publication

EP 1967596 A1 20080910 (EN)

Application

EP 08002634 A 20080213

Priority

  • JP 2007032623 A 20070213
  • JP 2007326559 A 20071218

Abstract (en)

This invention provides a copper alloy sheet material containing, in mass%, Ni: 0.7% - 4.2% and Si: 0.2% - 1.0%, optionally containing one or more of Sn: 1.2% or less, Zn: 2.0% or less, Mg: 1.0% or less, Co: 2.0% or less, and Fe: 1.0% or less, and a total of 3% or less of one or more of Cr, B, P, Zr, Ti, Mn and V, the balance being substantially Cu, and having a crystal orientation satisfying Expression (1): I 420 / I 0 420 > 1.0 where I{420} is the x-ray diffraction intensity from the {420} crystal plane in the sheet plane of the copper alloy sheet material and I 0 {420 } is the x-ray diffraction intensity from the {420} crystal plane of standard pure copper powder. The copper alloy sheet material has highly improved strength, post-notching bending workability, and stress relaxation resistance property.

IPC 8 full level

C22C 9/06 (2006.01); C22F 1/08 (2006.01)

CPC (source: EP)

C22C 1/06 (2013.01); C22C 9/06 (2013.01); C22F 1/08 (2013.01)

Citation (applicant)

DE 4115998 A1 19921119 - DIEHL GMBH & CO [DE]

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA MK RS

DOCDB simple family (publication)

EP 1967596 A1 20080910; EP 1967596 B1 20100616

DOCDB simple family (application)

EP 08002634 A 20080213