Global Patent Index - EP 1967608 A1

EP 1967608 A1 20080910 - High density ceramic and cermet sputtering targets by microwave sintering

Title (en)

High density ceramic and cermet sputtering targets by microwave sintering

Title (de)

Hochdichte Keramik und Cermet-Sputter-Targets durch Mikrowellensinterung

Title (fr)

Céramique haute densité et cibles de pulvérisation de cermet par frittage par micro-ondes

Publication

EP 1967608 A1 20080910 (EN)

Application

EP 08102036 A 20080226

Priority

  • US 90418507 P 20070301
  • US 95024007 A 20071204

Abstract (en)

A method of manufacturing sputtering targets from powder materials, comprising steps of: providing at least one raw powder material; forming the at least one raw powder material into a green body with density greater than about 40 % of theoretical maximum density; treating the green body with microwaves to form a sintered body with density greater than about 97 % of theoretical maximum density; and forming a sputtering target from the sintered body. The methodology is especially useful in the fabrication of targets comprising dielectric and cermet materials.

IPC 8 full level

C23C 14/34 (2006.01)

CPC (source: EP KR US)

B22F 3/105 (2013.01 - EP US); C04B 35/03 (2013.01 - KR); C04B 35/053 (2013.01 - EP US); C04B 35/10 (2013.01 - KR); C04B 35/111 (2013.01 - EP US); C04B 35/44 (2013.01 - EP US); C04B 35/46 (2013.01 - EP KR US); C04B 35/465 (2013.01 - EP US); C04B 35/481 (2013.01 - EP US); C04B 35/486 (2013.01 - EP US); C04B 35/491 (2013.01 - EP US); C04B 35/495 (2013.01 - EP US); C04B 35/5607 (2013.01 - EP US); C04B 35/583 (2013.01 - EP US); C04B 35/632 (2013.01 - EP US); C22C 1/051 (2013.01 - EP US); C22C 29/005 (2013.01 - EP US); C23C 14/3414 (2013.01 - EP US); B22F 2003/1054 (2013.01 - EP US); B22F 2998/10 (2013.01 - EP US); C04B 2111/90 (2013.01 - KR); C04B 2235/604 (2013.01 - EP US); C04B 2235/608 (2013.01 - EP US); C04B 2235/6562 (2013.01 - EP US); C04B 2235/6567 (2013.01 - EP US); C04B 2235/667 (2013.01 - EP US); C04B 2235/77 (2013.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA MK RS

DOCDB simple family (publication)

EP 1967608 A1 20080910; KR 20080080462 A 20080904; SG 145671 A1 20080929; US 2008210555 A1 20080904

DOCDB simple family (application)

EP 08102036 A 20080226; KR 20080019547 A 20080303; SG 2008015935 A 20080226; US 95024007 A 20071204