EP 1971710 A1 20080924 - ELECTROFORMED COMPONENT MANUFACTURE
Title (en)
ELECTROFORMED COMPONENT MANUFACTURE
Title (de)
HERSTELLUNG VON GALVANOPLASTIKBAUTEILEN
Title (fr)
FABRICATION DE COMPOSANTS PAR ÉLECTROFORMAGE
Publication
Application
Priority
- GB 2006004507 W 20061204
- GB 0524587 A 20051202
Abstract (en)
[origin: GB2432847A] A method of forming an electroformed component is described. The method comprises forming a conductive seed layer (figure 1, 5) on a substrate 3 by spraying at least a first solution onto the substrate to form a first conductive layer. A pattern resist 11 is provided over the conductive seed layer (figure 1, 5) and the component is then electroformed. The conductive seed layer (figure 1, 5) may comprise a layer of silver, the substrate may be glass 3 and the component may be a MEMS component such as an inkjet nozzle or a fuel injection nozzle. Apparatus for performing this method is also described.
IPC 8 full level
C25D 1/08 (2006.01); C23C 18/16 (2006.01)
CPC (source: EP GB)
B41J 2/162 (2013.01 - EP); B41J 2/1625 (2013.01 - EP); B41J 2/1631 (2013.01 - EP); B41J 2/1643 (2013.01 - EP); B41J 2/1645 (2013.01 - EP); C23C 18/1605 (2013.01 - EP); C23C 18/1653 (2013.01 - EP); C23C 18/1658 (2013.01 - EP); C23C 18/1893 (2013.01 - EP); C25D 1/00 (2013.01 - GB); C25D 1/08 (2013.01 - EP); C25D 1/10 (2013.01 - GB); C25D 5/022 (2013.01 - GB); G03F 7/12 (2013.01 - GB); H05K 3/143 (2013.01 - GB); H05K 3/1225 (2013.01 - EP)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
GB 0524587 D0 20060111; GB 2432847 A 20070606; EP 1971710 A1 20080924; TW 200728507 A 20070801; WO 2007063331 A1 20070607
DOCDB simple family (application)
GB 0524587 A 20051202; EP 06820393 A 20061204; GB 2006004507 W 20061204; TW 95144671 A 20061201