EP 1975982 A1 20081001 - PATTERN FORMATION METHOD AND PATTERN FORMATION APPARATUS, EXPOSURE METHO AND EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD
Title (en)
PATTERN FORMATION METHOD AND PATTERN FORMATION APPARATUS, EXPOSURE METHO AND EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD
Title (de)
STRUKTURERZEUGUNGSVERFAHREN UND STRUKTURERZEUGUNGSVORRICHTUNG, BELICHTUNGSVERFAHREN UND BELICHTUNGSVORRICHTUNG UND BAUELEMENTEHERSTELLUNGSVERFAHREN
Title (fr)
PROCEDE ET APPAREIL DE FORMATION DE MOTIF, PROCEDE ET APPAREIL D'INSOLATION ET PROCEDE DE FABRICATION DE DISPOSITIF
Publication
Application
Priority
- JP 2006326249 W 20061228
- JP 2005379948 A 20051228
Abstract (en)
In a measurement zone that is spaced apart in a Y-axis direction from an exposure zone that is located immediately below a projection unit (PU), a detection area of an alignment system (ALG) is moved in the Y-axis direction and a plurality of marks are sequentially detected, and therefore a movement distance of wafer stages (WST1, WST2) in the Y-axis direction when performing the mark detection can be decreased compared with the case where only the wafer stages are moved while fixing the alignment system and mark detection is performed as in the conventional cases. Accordingly, a width of the measurement zone in the Y-axis direction can be reduced, which allows the apparatus to be downsized.
IPC 8 full level
H01L 21/027 (2006.01); G03F 9/00 (2006.01)
CPC (source: EP KR US)
G03F 7/70216 (2013.01 - KR); G03F 7/70758 (2013.01 - KR); G03F 7/70775 (2013.01 - KR); G03F 9/7003 (2013.01 - EP KR US); G03F 9/7073 (2013.01 - KR); G03F 9/7088 (2013.01 - EP KR US)
Citation (search report)
See references of WO 2007077926A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 1975982 A1 20081001; CN 101326617 A 20081217; CN 101326617 B 20120620; CN 102636966 A 20120815; CN 102636966 B 20141203; IL 192122 A0 20081229; JP 2012074751 A 20120412; JP 5182558 B2 20130417; JP 5455166 B2 20140326; JP WO2007077926 A1 20090611; KR 101296546 B1 20130813; KR 20080088578 A 20081002; TW 200739285 A 20071016; TW I409598 B 20130921; US 2008291415 A1 20081127; US 8400614 B2 20130319; WO 2007077926 A1 20070712
DOCDB simple family (application)
EP 06843627 A 20061228; CN 200680046584 A 20061228; CN 201210110459 A 20061228; IL 19212208 A 20080612; JP 2006326249 W 20061228; JP 2007552986 A 20061228; JP 2012007273 A 20120117; KR 20087011228 A 20061228; TW 95149383 A 20061228; US 14422608 A 20080623