Global Patent Index - EP 1983808 A1

EP 1983808 A1 20081022 - Method for manufacturing tape carrier for contact type IC card

Title (en)

Method for manufacturing tape carrier for contact type IC card

Title (de)

Verfahren zur Herstellung eines Trägerbands für Kontakt-IC-Karten

Title (fr)

Procédé de fabrication de support de bande pour carte CI à contact

Publication

EP 1983808 A1 20081022 (EN)

Application

EP 07007826 A 20070417

Priority

EP 07007826 A 20070417

Abstract (en)

A method for manufacturing a tape carrier for a contact type IC card including a substrate. The method includes punching a conductive foil with a punching tool to obtain a pad group including a plurality of contact pads, and arranging the pad group on a substrate made of an insulative material. This reduces the processes, work, and cost for manufacturing a tape carrier in comparison to when performing lithography.

IPC 8 full level

H05K 1/11 (2006.01); H05K 3/04 (2006.01); H05K 3/20 (2006.01); H05K 3/40 (2006.01)

CPC (source: EP)

H01L 23/49855 (2013.01); H05K 3/041 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H05K 1/0393 (2013.01); H05K 3/20 (2013.01); H05K 2203/0191 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA HR MK RS

DOCDB simple family (publication)

EP 1983808 A1 20081022

DOCDB simple family (application)

EP 07007826 A 20070417