Global Patent Index - EP 1983911 A4

EP 1983911 A4 20130220 - A FRACTURE FIXATION DEVICE AND IMPLANTATION JIG THEREFOR

Title (en)

A FRACTURE FIXATION DEVICE AND IMPLANTATION JIG THEREFOR

Title (de)

FRAKTURFIXIERUNGSVORRICHTUNG UND IMPLANTIERUNGSAUFSPANNVORRICHTUNG DAFÜR

Title (fr)

DISPOSITIF DE FIXATION DE FRACTURES ET MONTAGE D'IMPLANTATION POUR CELUI-CI

Publication

EP 1983911 A4 20130220 (EN)

Application

EP 06733966 A 20060127

Priority

US 2006002919 W 20060127

Abstract (en)

[origin: WO2007086854A1] A fracture fixation device includes a plate portion and an intramedullary nail portion which is offset relative to the plate portion by a neck portion. The plate portion includes longitudinally displaced peg holes which orient pegs along an imaginary surface parallel to subchondral bone of an articular surface. The upper surface of the plate portion includes a dimple to reference a jig. The nail portion includes threaded screw holes oriented normal to an endosteal surface, and a smaller K- wire alignment hole parallel to the screw holes. The jig has a first portion which references with the dimple and a second portion in alignment over the screw holes of the nail portion. The back of the first portion of the jig is curved upward to facilitate maneuvering of the jig. The first and second portions of the jig includes K-wire guide holes which direct K-wires relative to holes in the device.

IPC 8 full level

A61B 17/56 (2006.01); A61B 17/58 (2006.01); A61B 17/72 (2006.01); A61F 2/30 (2006.01); A61B 17/84 (2006.01)

CPC (source: EP)

A61B 17/1725 (2013.01); A61B 17/72 (2013.01); A61B 17/7233 (2013.01); A61B 17/8061 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2007086854 A1 20070802; AU 2006336444 A1 20070802; CA 2640225 A1 20070802; EP 1983911 A1 20081029; EP 1983911 A4 20130220; IL 193043 A0 20090211; IL 193043 A 20130131; JP 2009524473 A 20090702; NO 20083686 L 20080827

DOCDB simple family (application)

US 2006002919 W 20060127; AU 2006336444 A 20060127; CA 2640225 A 20060127; EP 06733966 A 20060127; IL 19304308 A 20080724; JP 2008552276 A 20060127; NO 20083686 A 20080827