Global Patent Index - EP 1985736 B1

EP 1985736 B1 20111012 - Method for applying flat pieces of material, cutting device and sewing machine for carrying out the method

Title (en)

Method for applying flat pieces of material, cutting device and sewing machine for carrying out the method

Title (de)

Verfahren zum Applizieren von flächigen Materialstücken, sowie Schneidvorrichtung und Stickmaschine zur Durchführung des Verfahrens

Title (fr)

Procédé destiné à appliquer des pièces plates de matériau, dispositif de coupe et machine à broder pour la mise en oeuvre du procédé

Publication

EP 1985736 B1 20111012 (DE)

Application

EP 08405032 A 20080207

Priority

  • CH 6502007 A 20070420
  • CH 16572007 A 20071024

Abstract (en)

[origin: EP1985736A1] The method involves arranging at least one material layer (73) over the embroidery base (75) and producing a controlled relative movement between the cutter (15) and the material layer to cut a flat piece of material of the desired shape out of the material layer. The cutter is controlled by the control program of the embroidery machine to be brought into a cutting position and is returned to the initial position after carrying out the cutting procedure : Independent claims are also included for the following: (A) a cutting device for an embroidery machine (B) and an embroidery machine.

IPC 8 full level

D05C 7/10 (2006.01); D05C 7/04 (2006.01); D05C 7/08 (2006.01)

CPC (source: EP KR)

D05B 3/00 (2013.01 - KR); D05B 21/00 (2013.01 - KR); D05B 37/00 (2013.01 - KR); D05B 37/04 (2013.01 - KR); D05C 7/04 (2013.01 - EP); D05C 7/08 (2013.01 - EP); D05C 7/10 (2013.01 - EP)

Designated contracting state (EPC)

AT CH DE LI

DOCDB simple family (publication)

EP 1985736 A1 20081029; EP 1985736 B1 20111012; AT E528428 T1 20111015; KR 101415013 B1 20140704; KR 20080094598 A 20081023; TW 200912081 A 20090316; TW I377276 B 20121121

DOCDB simple family (application)

EP 08405032 A 20080207; AT 08405032 T 20080207; KR 20080035934 A 20080418; TW 97105542 A 20080218