EP 1986950 A4 20140604 - MEMS COMPONENTS AND METHOD FOR MANUFACTURING SAME
Title (en)
MEMS COMPONENTS AND METHOD FOR MANUFACTURING SAME
Title (de)
MEMS-BAUTEILE UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
COMPOSANTS MEMS ET LEURS PROCÉDÉS DE FABRICATION
Publication
Application
Priority
- SE 2007050050 W 20070131
- SE 0600210 A 20060131
Abstract (en)
[origin: WO2007089204A1] The invention relates to a method for making a MEMS device having connectors for interconnecting components in the MEMS device. The method comprises applying a sacrificial material layer on a first substrate wafer, the thickness of the sacrificial layer essentially defining the length of the connectors. Connectors made of electrically conducting and/ or mechanically rigid material are provided and embedded in the sacrificial material layer. Components are provided on top of the sacrificial layer by 3D integration with wafer bonding, to connect the components to the connectors. It also relates to a MEMS device made by 3D integration with wafer bonding comprising first and a second components interconnected by connectors having a length of > 4µm. The components can comprise integrated circuits.
IPC 8 full level
B81C 1/00 (2006.01); H01L 21/98 (2006.01)
CPC (source: EP)
B81C 1/00714 (2013.01); B81B 2201/0278 (2013.01); B81B 2201/042 (2013.01)
Citation (search report)
- No further relevant documents disclosed
- See references of WO 2007089204A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2007089204 A1 20070809; EP 1986950 A1 20081105; EP 1986950 A4 20140604
DOCDB simple family (application)
SE 2007050050 W 20070131; EP 07709443 A 20070131