EP 1987532 A1 20081105 - METHOD FOR PRODUCING PLANAR INSULATING LAYERS WITH BREAKTHROUGHS AT THE CORRECT POSITION BY MEANS OF LASER CUTTING AND DEVICES PRODUCED ACCORDINGLY
Title (en)
METHOD FOR PRODUCING PLANAR INSULATING LAYERS WITH BREAKTHROUGHS AT THE CORRECT POSITION BY MEANS OF LASER CUTTING AND DEVICES PRODUCED ACCORDINGLY
Title (de)
VERFAHREN ZUR HERSTELLUNG VON PLANAREN ISOLIERSCHICHTEN MIT POSITIONSGERECHTEN DURCHBRÜCHEN MITTELS LASERSCHNEIDEN UND ENTSPRECHEND HERGESTELLTE VORRICHTUNGEN
Title (fr)
PROCÉDÉ POUR PRODUIRE DES COUCHES ISOLANTES PLANES PRÉSENTANT DES OUVERTURES CONFORMES À LA POSITION AU MOYEN D'UNE DÉCOUPE AU LASER ET DISPOSITIFS AINSI PRODUITS
Publication
Application
Priority
- EP 2006070021 W 20061220
- DE 102006007795 A 20060220
- DE 102006010523 A 20060307
Abstract (en)
[origin: DE102006010523B3] A method of contacting an electrical contact surface on a substrate (1) and/or a component on this comprises laminating a film of electrically insulating plastic (4) on the surface, making accessible surface contacts (6) through openings (3) formed by laser cutting using a layer of electrically conductive material. The film openings corresponding to the individual contact surfaces are produced according to data determined by automatic optical inspection. An independent claim is also included for a device for the above method.
IPC 8 full level
H01L 21/48 (2006.01); H01L 21/60 (2006.01); H01L 23/538 (2006.01); H01L 23/544 (2006.01)
CPC (source: EP US)
H01L 21/481 (2013.01 - EP US); H01L 21/486 (2013.01 - EP US); H01L 23/3164 (2013.01 - EP US); H01L 23/5389 (2013.01 - EP US); H01L 23/544 (2013.01 - EP US); H01L 24/82 (2013.01 - EP US); H05K 3/281 (2013.01 - EP US); H01L 2223/5442 (2013.01 - EP US); H01L 2223/54426 (2013.01 - EP US); H01L 2223/54473 (2013.01 - EP US); H01L 2224/2402 (2013.01 - EP US); H01L 2224/82039 (2013.01 - EP US); H01L 2224/82047 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/0102 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H05K 1/0269 (2013.01 - EP US); H05K 3/0032 (2013.01 - EP US); H05K 2201/09918 (2013.01 - EP US); H05K 2203/063 (2013.01 - EP US); H05K 2203/166 (2013.01 - EP US); Y10T 29/49126 (2015.01 - EP US); Y10T 29/4913 (2015.01 - EP US); Y10T 29/49155 (2015.01 - EP US); Y10T 29/49165 (2015.01 - EP US); Y10T 156/1062 (2015.01 - EP US)
Citation (search report)
See references of WO 2007096017A1
Citation (examination)
- US 4835704 A 19890530 - EICHELBERGER CHARLES W [US], et al
- ANONYMOUS: "LASER DRILLING", WIKIPEDIA, THE FREE ENCYCLOPEDIA, 18 December 2015 (2015-12-18), XP055237592, Retrieved from the Internet <URL:https://en.wikipedia.org/wiki/Laser_drilling> [retrieved on 20151218]
- ANONYMOUS: "LASER CUTTING", WIKIPEDIA, THE FREE ENCYCLOPEDIA, 18 December 2015 (2015-12-18), XP055237588, Retrieved from the Internet <URL:https://en.wikipedia.org/w/index.php?title=Laser_cutting&printable=yes> [retrieved on 20151218]
- ANONYMOUS: "GAUSSIAN BEAM", WIKIPEDIA, THE FREE ENCYCLOPEDIA, 17 February 2006 (2006-02-17), XP055242281, Retrieved from the Internet <URL:https://en.wikipedia.org/w/index.php?title=Gaussian_beam&oldid=40078979> [retrieved on 20160118]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102006010523 B3 20070802; EP 1987532 A1 20081105; US 2009021923 A1 20090122; US 8191243 B2 20120605; WO 2007096017 A1 20070830
DOCDB simple family (application)
DE 102006010523 A 20060307; EP 06849411 A 20061220; EP 2006070021 W 20061220; US 22409406 A 20061220