Global Patent Index - EP 1988572 A1

EP 1988572 A1 20081105 - Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips

Title (en)

Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips

Title (de)

Elektronischer Stromkreis mit Flüssigkeitskühlung mit einem geschichteten Array direkt gekühlter Halbleiterchips

Title (fr)

Circuit électronique à refroidissement liquide comportant un système d'éléments de rangement de puces à semi-conducteur refroidies directement

Publication

EP 1988572 A1 20081105 (EN)

Application

EP 08154019 A 20080403

Priority

US 79992507 A 20070503

Abstract (en)

A stacked array (10/40) of channeled semiconductor chips (12a-12d) defining a power electronic circuit is mounted in a sealed container (50) provided with inlet and outlet passages (66, 68) for liquid coolant. Leadframe terminals (58a-58f, 64a-64b, 70) supported by the container (50) engage selected terminals (14, 16, 18) of the semiconductor chips (12a-12d) and form leads for mounting the container (50) on a circuit board having electrical and fluid interconnects.

IPC 8 full level

H01L 23/473 (2006.01); H01L 25/065 (2006.01)

CPC (source: EP US)

H01L 23/473 (2013.01 - EP US); H01L 25/074 (2013.01 - EP US); H01L 2225/06555 (2013.01 - EP); H01L 2225/06562 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H01L 2924/10158 (2013.01 - EP US)

Citation (applicant)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA MK RS

DOCDB simple family (publication)

EP 1988572 A1 20081105; US 2008272484 A1 20081106; US 7795726 B2 20100914

DOCDB simple family (application)

EP 08154019 A 20080403; US 79992507 A 20070503