EP 1992013 A2 20081119 - METHOD AND APPARATUS FOR THERMAL PROCESSING STRUCTURES FORMED ON A SUBSTRATE
Title (en)
METHOD AND APPARATUS FOR THERMAL PROCESSING STRUCTURES FORMED ON A SUBSTRATE
Title (de)
VERFAHREN UND VORRICHTUNG ZUR THERMISCHEN VERARBEITUNG VON AUF EINEM SUBSTRAT GEBILDETEN STRUKTUREN
Title (fr)
PROCÉDÉ ET APPAREIL PERMETTANT D'EFFECTUER UN TRAITEMENT THERMIQUE DE STRUCTURES FORMÉES SUR UN SUBSTRAT
Publication
Application
Priority
- US 2007062672 W 20070223
- US 78074506 P 20060308
- US 45984706 A 20060725
- US 45985206 A 20060725
- US 45985606 A 20060725
Abstract (en)
[origin: WO2007103643A2] The present invention generally describes one ore more apparatuses and various methods that are used to perform an annealing process on desired regions of a substrate. In one embodiment, an amount of energy is delivered to the surface of the substrate to preferentially melt certain desired regions of the substrate to remove unwanted damage created from prior processing steps, more evenly distribute dopants in various regions of the substrate, and/or activate various regions of the substrate. The preferential melting processes will allow more uniform distribution of the dopants in the melted region, due to the increased diffusion rate and solubility of the dopant atoms in the molten region of the substrate. The creation of a melted region thus allows: 1) the dopant atoms to redistribute more uniformly, 2) defects created in prior processing steps to be removed, and 3) regions that have hyper-abrupt dopant concentrations to be formed.
IPC 8 full level
H01L 21/76 (2006.01)
CPC (source: EP KR)
H01L 21/324 (2013.01 - KR); H01L 21/823418 (2013.01 - EP); H01L 21/823425 (2013.01 - EP); H01L 21/823475 (2013.01 - EP)
Citation (search report)
See references of WO 2007103643A2
Designated contracting state (EPC)
DE FR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
WO 2007103643 A2 20070913; WO 2007103643 A3 20080508; WO 2007103643 B1 20080626; EP 1992013 A2 20081119; JP 2009529245 A 20090813; JP 5558006 B2 20140723; KR 101113533 B1 20120229; KR 101323222 B1 20131030; KR 20080104183 A 20081201; KR 20100133454 A 20101221
DOCDB simple family (application)
US 2007062672 W 20070223; EP 07757396 A 20070223; JP 2008558449 A 20070223; KR 20087024646 A 20070223; KR 20107024018 A 20070223