EP 1993110 A1 20081119 - Method of manufacturing rare-earth magnet powder and method of manufacturing rare-earth bonded magnet
Title (en)
Method of manufacturing rare-earth magnet powder and method of manufacturing rare-earth bonded magnet
Title (de)
Verfahren zur Herstellung von Seltenerdmagnetpulver und Verfahren zur Herstellung von Seltenerdmagneten
Title (fr)
Procédé de fabrication de poudre magnétique de terres rares et procédé de fabrication d'aimant à liant de terres rares
Publication
Application
Priority
JP 2007128488 A 20070514
Abstract (en)
A method of manufacturing rare-earth magnet powder having excellent magnetic properties, and a method of manufacturing a rare-earth bond magnet are provided. A nitriding step is performed, in which when nitrided rare-earth magnet powder is produced, rare-earth-element/transition metal-based alloy powder is irradiated with a microwave at an atmosphere containing nitrogen atoms, so that the nitrogen atoms are allowed to enter into a crystal lattice.
IPC 8 full level
H01F 1/059 (2006.01); H01F 41/02 (2006.01)
CPC (source: EP US)
H01F 1/059 (2013.01 - EP US); H01F 41/0266 (2013.01 - EP US); H01F 41/0273 (2013.01 - EP US)
Citation (applicant)
- JP H05109518 A 19930430 - KANEGAFUCHI CHEMICAL IND
- JP H05135978 A 19930601 - SEIKO EPSON CORP
- JP H1187118 A 19990330 - TOSHIBA CORP
- IMAOKA ET AL.: "Magnetic Properties andNitriding Process of Sm2Fe17Nx", TRANSACTION A OF THE INSTITUTE OF ELECTRICAL ENGINEERS OF JAPAN, vol. 113, no. 4, 28 September 1992 (1992-09-28), pages 276 - 285
- "Magnetic Properties and Nitriding Process of Sm2Fe17Nx", TRANSACTION A OF THE INSTITUTE OF ELECTRICAL ENGINEERS OF JAPAN, vol. 113, no. 4
Citation (search report)
- [X] EP 0470475 A2 19920212 - SIEMENS AG [DE]
- [X] WO 9405021 A1 19940303 - MARTINEX R & D INC [CA], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
EP 1993110 A1 20081119; CN 101306467 A 20081119; JP 2008283141 A 20081120; US 2012164019 A1 20120628
DOCDB simple family (application)
EP 08251659 A 20080509; CN 200810107835 A 20080514; JP 2007128488 A 20070514; US 15222208 A 20080512