EP 1995793 A4 20170705 - PHOTODIODE, METHOD FOR MANUFACTURING SUCH PHOTODIODE, OPTICAL COMMUNICATION DEVICE AND OPTICAL INTERCONNECTION MODULE
Title (en)
PHOTODIODE, METHOD FOR MANUFACTURING SUCH PHOTODIODE, OPTICAL COMMUNICATION DEVICE AND OPTICAL INTERCONNECTION MODULE
Title (de)
LICHTDIODE, VERFAHREN ZUR HERSTELLUNG EINER DERARTIGEN LICHTDIODE, OPTISCHE KOMMUNIKATIONSVORRICHTUNG UND OPTISCHES VERBINDUNGSMODUL
Title (fr)
PHOTODIODE, PROCEDE DE FABRICATION D'UNE TELLE PHOTODIODE, DISPOSITIF DE COMMUNICATION OPTIQUE ET MODULE D'INTERCONNEXION OPTIQUE
Publication
Application
Priority
- JP 2007054545 W 20070308
- JP 2006067594 A 20060313
Abstract (en)
[origin: EP1995793A1] Both high light receiving sensitivity and high speed of a photodiode are achieved at the same time. The photodiode is provided with a semiconductor layer (1) and a pair of metal electrodes (2) which are arranged on the surface of the semiconductor layer (1) at an interval (d) and form an MSM junction. The interval (d) satisfies the relationship of »>d>»/100, where » is the wavelength of incident light. The metal electrodes (2) can induce surface plasmon. At least one of the electrodes forms a Schottky junction with the semiconductor layer (1), and a low end portion is embedded in the semiconductor layer (1) to a position at a depth less than »/2n, where n is the refractive index of the semiconductor layer (1).
IPC 8 full level
H01L 31/108 (2006.01)
CPC (source: EP US)
H01L 31/022408 (2013.01 - EP US); H01L 31/1085 (2013.01 - EP US)
Citation (search report)
- [XI] US 2003010979 A1 20030116 - PARDO FABRICE [FR], et al
- [A] US 2003185135 A1 20031002 - FUJIKATA JUNICHI [JP], et al
- See references of WO 2007105593A1
Designated contracting state (EPC)
BE DE FR
DOCDB simple family (publication)
EP 1995793 A1 20081126; EP 1995793 A4 20170705; CN 101438419 A 20090520; CN 101438419 B 20120222; JP WO2007105593 A1 20090730; US 2009134486 A1 20090528; US 7800193 B2 20100921; WO 2007105593 A1 20070920
DOCDB simple family (application)
EP 07738036 A 20070308; CN 200780016396 A 20070308; JP 2007054545 W 20070308; JP 2008505093 A 20070308; US 28295907 A 20070308