EP 1996795 A2 20081203 - QUASICRYSTALLINE COMPOUND AND THE USE THEREOF AS A HEAT INSULATING LAYER
Title (en)
QUASICRYSTALLINE COMPOUND AND THE USE THEREOF AS A HEAT INSULATING LAYER
Title (de)
QUASIKRISTALLINE VERBINDUNG UND DEREN VERWENDUNG ALS WÄRMEDÄMMSCHICHT
Title (fr)
COMPOSÉ QUASICRISTALLIN ET SON UTILISATION COMME COUCHE D'ISOLATION THERMIQUE
Publication
Application
Priority
- EP 2007052732 W 20070322
- EP 06006053 A 20060323
- EP 07727208 A 20070322
Abstract (en)
[origin: EP1837484A2] Compounds of formula: Al wCo xM yare new. M is Ni and/or Cr and at least 30 mass% of the compound has a quasi-crystalline structure. W = 70 - 76 and w + x + y = 100. Independent claims are included for: (A) coatings made form or containing the compounds; (B) coating systems containing a coating made from the compounds; (C) multi-layer coating systems containing two or more of the coating systems; (D) use of the compounds as heat-insulating coatings for components subjected to high temperature, especially turbine steam inlets (333) and blades (357); and (E) use of compounds containing aluminum and manganese, at least 30 mass% of the compound having a quasi-crystalline structure, for the same purpose.
IPC 8 full level
F01D 5/28 (2006.01); C22C 21/00 (2006.01); C23C 4/08 (2006.01); C23C 28/00 (2006.01); C23C 28/02 (2006.01); C23C 30/00 (2006.01)
CPC (source: EP US)
C22C 21/00 (2013.01 - EP US); C23C 4/08 (2013.01 - EP US); C23C 28/321 (2013.01 - EP US); C23C 28/3215 (2013.01 - EP US); C23C 28/3455 (2013.01 - EP US); C23C 30/00 (2013.01 - EP US); F01D 5/288 (2013.01 - EP US); F05C 2201/0466 (2013.01 - EP US); F05D 2300/132 (2013.01 - EP US); Y10T 428/12535 (2015.01 - EP US); Y10T 428/31678 (2015.04 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 1837484 A2 20070926; EP 1837484 A3 20071128; AT E514838 T1 20110715; CN 101405477 A 20090408; CN 101405477 B 20120627; EP 1996795 A2 20081203; EP 1996795 B1 20110629; JP 2009530498 A 20090827; PL 1996795 T3 20111130; US 2010227194 A1 20100909; WO 2007107602 A2 20070927; WO 2007107602 A3 20080117
DOCDB simple family (application)
EP 06006053 A 20060323; AT 07727208 T 20070322; CN 200780010370 A 20070322; EP 07727208 A 20070322; EP 2007052732 W 20070322; JP 2009500869 A 20070322; PL 07727208 T 20070322; US 22532807 A 20070322