Global Patent Index - EP 2001085 B1

EP 2001085 B1 20100519 - Method for manufacturing an electrically conducting connection

Title (en)

Method for manufacturing an electrically conducting connection

Title (de)

Verfahren zur Herstellung einer elektrisch leitenden Verbindung

Title (fr)

Procédé de fabrication d'une liaison électrique conductrice

Publication

EP 2001085 B1 20100519 (DE)

Application

EP 07290704 A 20070606

Priority

EP 07290704 A 20070606

Abstract (en)

[origin: EP2001085A1] The method involves masking a junction point between a contact element (4) and a contact member (9) in damp-proof and gas-tight manner. A conductor (1) has a crimping length of one millimeter to six millimeters, particularly two millimeters to four millimeters. The conductor is inserted into a housing portion (6) of a connector (V) with the contact element, where the housing is made of plastic. The conductor has aluminum.

IPC 8 full level

H01R 4/18 (2006.01); H01R 4/62 (2006.01); H01R 13/52 (2006.01)

CPC (source: EP)

H01R 4/18 (2013.01); H01R 4/62 (2013.01); H01R 13/5221 (2013.01)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 2001085 A1 20081210; EP 2001085 B1 20100519; AT E468629 T1 20100615; DE 502007003854 D1 20100701; ES 2357827 T3 20110503

DOCDB simple family (application)

EP 07290704 A 20070606; AT 07290704 T 20070606; DE 502007003854 T 20070606; ES 07290704 T 20070606