EP 2004374 A1 20081224 - DEVICE FOR BREAKING SEMICONDUCTOR WAFERS OR SIMILAR SUBSTRATES
Title (en)
DEVICE FOR BREAKING SEMICONDUCTOR WAFERS OR SIMILAR SUBSTRATES
Title (de)
VORRICHTUNG ZUM BRECHEN VON HALBLEITERSCHEIBEN ODER ÄHNLICHEN SUBSTRATEN
Title (fr)
DISPOSITIF POUR BRISER DES PLAQUETTES À SEMI-CONDUCTEURS OU DES SUBSTRATS SIMILAIRES
Publication
Application
Priority
- EP 2007002899 W 20070330
- DE 102006015142 A 20060331
Abstract (en)
[origin: DE102006015142A1] The device has a breaking wedge (4) arranged at a lower side of a semiconductor wafer (1) aligned to a preset break line. Two counter supports (5, 6) are provided and are turned towards a top side of the wafer, where the counter supports are positioned vertically and horizontally at sides of the preset break line, and the sides are arranged opposite to each other. The two counter supports are positionable independent of each other.
IPC 8 full level
B28D 5/00 (2006.01); C03B 33/033 (2006.01)
CPC (source: EP)
B28D 5/0011 (2013.01); B28D 5/0023 (2013.01); B28D 5/0052 (2013.01); C03B 33/033 (2013.01)
Citation (search report)
See references of WO 2007112983A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
DE 102006015142 A1 20071004; DE 102006015142 B4 20140220; EP 2004374 A1 20081224; WO 2007112983 A1 20071011
DOCDB simple family (application)
DE 102006015142 A 20060331; EP 07723840 A 20070330; EP 2007002899 W 20070330