EP 2004871 A1 20081224 - METHOD FOR THE HEAT TREATMENT OF A PROFILE, DEVICE FOR THE HEAT TREATMENT OF A PROFILE AND PROFILE
Title (en)
METHOD FOR THE HEAT TREATMENT OF A PROFILE, DEVICE FOR THE HEAT TREATMENT OF A PROFILE AND PROFILE
Title (de)
VERFAHREN ZUR WÄRMEBEHANDLUNG EINES PROFILS, VORRICHTUNG ZUR WÄRMEBEHANDLUNG EINES PROFILS SOWIE PROFIL
Title (fr)
PROCÉDÉ DE TRAITEMENT THERMIQUE D'UN PROFILÉ, DISPOSITIF DE TRAITEMENT THERMIQUE D'UN PROFILÉ ET PROFILÉ
Publication
Application
Priority
EP 2006003442 W 20060413
Abstract (en)
[origin: WO2007118489A1] The invention relates firstly to a method for the heat treatment of a profile (1, 26), in particular an extruded profile for aircraft. Furthermore, the invention relates to a device for the heat treatment of such a profile (1, 26). In addition, the invention relates to such a profile (1, 26), heat-treated by the method according to the invention. The profile (1, 26) may in this case be formed by one or more different, in particular curable, aluminium alloys. The method according to the invention provides that at least two regions (2, 3, 37, 38) of a profile (1, 26) are subjected to a different heat treatment. The device for carrying out the method according to the invention is characterized in that a first chamber (17) encloses a first region (2, 37) of a profile (1, 26) and a second chamber (18) encloses a second region (3, 38) of the profile (1, 26), wherein different temperatures can be set in the first and second chambers (17, 18). The profile (1, 26) produced by the method according to the invention and with the device according to the invention has at least two regions (2, 3, 37, 38) that each have different material properties and are formed by differential heat treatment.
IPC 8 full level
C22F 1/05 (2006.01); C21D 9/00 (2006.01); C21D 9/22 (2006.01); C22F 1/053 (2006.01); C22F 1/057 (2006.01)
CPC (source: EP US)
C21D 9/0025 (2013.01 - EP US); C21D 9/22 (2013.01 - EP US); C22F 1/05 (2013.01 - EP US); C22F 1/053 (2013.01 - EP US); C22F 1/057 (2013.01 - EP US)
Citation (search report)
See references of WO 2007118489A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2007118489 A1 20071025; BR PI0621538 A2 20111213; CA 2643824 A1 20071025; CA 2643824 C 20130122; CN 101415855 A 20090422; CN 101415855 B 20111228; EP 2004871 A1 20081224; JP 2009533224 A 20090917; JP 4815531 B2 20111116; US 2009165900 A1 20090702; US 8101120 B2 20120124
DOCDB simple family (application)
EP 2006003442 W 20060413; BR PI0621538 A 20060413; CA 2643824 A 20060413; CN 200680054183 A 20060413; EP 06724329 A 20060413; JP 2009504569 A 20060413; US 22623106 A 20060413