Global Patent Index - EP 2006401 A1

EP 2006401 A1 20081224 - Pb-free copper-alloy sliding material

Title (en)

Pb-free copper-alloy sliding material

Title (de)

Bleifreier Kupferlegierungs-Gleitwerkstoff

Title (fr)

Matériau coulissant en alliage de cuivre sans plomb

Publication

EP 2006401 A1 20081224 (EN)

Application

EP 08013143 A 20050113

Priority

  • EP 05703541 A 20050113
  • JP 2004008205 A 20040115

Abstract (en)

[Task] Bi and hard matters of the Cu-Bi-hard matter based sintered alloy should fully exhibit the respective properties. [Means for Solution] In a Pb-free copper-based sintered alloy containing from 1 to 30 % of Bi and from 0.1 to 10 % of hard matter particles having from 10 to 50 ¼m of average particle diameter, (1) the Bi phase has smaller average particle diameter than that of the hard matter particles and is dispersed in the Cu matrix.

IPC 8 full level

C22C 1/05 (2006.01); C22C 1/04 (2006.01); C22C 9/00 (2006.01); C22C 32/00 (2006.01); F16C 33/12 (2006.01)

CPC (source: EP KR US)

C22C 1/05 (2013.01 - KR); C22C 9/00 (2013.01 - EP KR US); C22C 32/0073 (2013.01 - EP US); C22C 32/0089 (2013.01 - EP US); F16C 33/121 (2013.01 - EP US); B22F 2998/10 (2013.01 - EP US); B22F 2999/00 (2013.01 - EP US); F16C 2204/18 (2013.01 - EP)

C-Set (source: EP US)

  1. B22F 2998/10 + C22C 1/05 + B22F 3/10 + B22F 3/18 + B22F 3/10
  2. B22F 2999/00 + B22F 3/10 + B22F 2201/013 + B22F 2201/013

Citation (applicant)

JP 2002012902 A 20020115 - TAIHO KOGYO CO LTD

Citation (search report)

Designated contracting state (EPC)

DE FR GB HU IT

DOCDB simple family (publication)

EP 1717325 A1 20061102; EP 1717325 A4 20071219; EP 1717325 B1 20120606; CN 100480409 C 20090422; CN 101550502 A 20091007; CN 101550502 B 20110907; CN 101760662 A 20100630; CN 101760662 B 20111116; CN 1910300 A 20070207; DE 602005015496 D1 20090827; EP 2006401 A1 20081224; EP 2006401 B1 20090715; JP 2005200703 A 20050728; JP 4476634 B2 20100609; KR 100814656 B1 20080318; KR 20060121942 A 20061129; US 2008095658 A1 20080424; US 7678173 B2 20100316; WO 2005068671 A1 20050728

DOCDB simple family (application)

EP 05703541 A 20050113; CN 200580002589 A 20050113; CN 200910118289 A 20050113; CN 200910118290 A 20050113; DE 602005015496 T 20050113; EP 08013143 A 20050113; JP 2004008205 A 20040115; JP 2005000302 W 20050113; KR 20067014168 A 20060714; US 58599305 A 20050113