EP 2008305 A2 20081231 - ELECTRONIC COMPONENT MODULE
Title (en)
ELECTRONIC COMPONENT MODULE
Title (de)
ELEKTRONISCHES BAUELEMENTMODUL
Title (fr)
MODULE COMPOSANT ÉLECTRONIQUE
Publication
Application
Priority
- EP 2007053523 W 20070411
- DE 102006018161 A 20060419
Abstract (en)
[origin: WO2007118831A2] The invention relates to an electronic component module, comprising at least one first multi-layer circuit board module (21, 22; 31, 32; 41, 42) and a cooling arrangement (23, 33, 43), the cooling arrangement (23, 33, 43) being in contact with an upper side of the circuit board module (21, 22; 31, 32; 41, 42). The cooling arrangement (23, 33, 43) is designed such that waste heat generated during operation of the electronic component module (2, 3, 4) is extracted in a lateral direction with relation to the arrangement of the circuit board module (21,22; 31, 32; 41, 42) by means of the cooling arrangement (23, 33, 43).
IPC 8 full level
H01L 25/065 (2006.01); H01L 25/07 (2006.01)
CPC (source: EP KR US)
H01L 23/12 (2013.01 - KR); H01L 23/34 (2013.01 - KR); H01L 25/065 (2013.01 - KR); H01L 25/0657 (2013.01 - EP US); H01L 25/07 (2013.01 - KR); H01L 25/071 (2013.01 - EP US); H01L 25/074 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48137 (2013.01 - EP US); H01L 2224/48235 (2013.01 - EP US); H01L 2224/48472 (2013.01 - EP US); H01L 2225/06589 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/09701 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/19107 (2013.01 - EP US)
C-Set (source: EP US)
Citation (search report)
See references of WO 2007118831A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
DE 102006018161 A1 20071025; CA 2650547 A1 20071025; CN 101427371 A 20090506; CN 101427371 B 20111214; EP 2008305 A2 20081231; JP 2009534822 A 20090924; JP 4940295 B2 20120530; KR 101478518 B1 20150106; KR 20090005190 A 20090112; TW 200810677 A 20080216; US 2009097208 A1 20090416; US 8164904 B2 20120424; WO 2007118831 A2 20071025; WO 2007118831 A3 20080221
DOCDB simple family (application)
DE 102006018161 A 20060419; CA 2650547 A 20070411; CN 200780013789 A 20070411; EP 07727991 A 20070411; EP 2007053523 W 20070411; JP 2009505850 A 20070411; KR 20087028133 A 20070411; TW 96113450 A 20070417; US 22647107 A 20070411