EP 2010699 A2 20090107 - ELECTROPLATING DEVICE AND METHOD
Title (en)
ELECTROPLATING DEVICE AND METHOD
Title (de)
VORRICHTUNG UND VERFAHREN ZUR GALVANISCHEN BESCHICHTUNG
Title (fr)
DISPOSITIF ET PROCÉDÉ DE REVÊTEMENT GALVANIQUE
Publication
Application
Priority
- EP 2007053707 W 20070417
- EP 06112723 A 20060418
- EP 07728172 A 20070417
Abstract (en)
[origin: WO2007118875A2] The invention relates to a device for electroplating at least one electrically conductive substrate (8), or an electrically conductive structure situated on a non-conductive substrate (8). Said device comprises at least one bath, an anode and a cathode (2). The bath contains an electrolyte solution, which comprises at least one metal salt and from which metal ions are deposited on electrically conductive surfaces of the substrate, as the cathode is brought into contact with the surface of the substrate to be coated and said substrate is conveyed through the bath. The cathode comprises at least one strip (2) with at least one electrically conductive segment (12) and is guided around at least two rotating shafts (3). The invention also relates to a method for electroplating at least one substrate that is carried out in a device according to the invention. According to said method, to produce the coating, the strip lies on the substrate and circulates at a speed corresponding to the speed at which the substrate is conveyed through the bath. The invention further relates to the use of said device for electroplating electrically conductive structures situated on an electrically non-conductive support.
IPC 8 full level
C25D 7/00 (2006.01); C25D 7/06 (2006.01); C25D 17/00 (2006.01); H05K 3/24 (2006.01)
CPC (source: EP KR US)
C25D 5/06 (2013.01 - EP KR US); C25D 5/54 (2013.01 - EP KR US); C25D 5/56 (2013.01 - EP KR US); C25D 7/00 (2013.01 - KR); C25D 7/0621 (2013.01 - EP KR US); C25D 17/005 (2013.01 - EP KR US); C25D 17/12 (2013.01 - EP KR US); C25D 17/14 (2013.01 - EP KR US); H05K 3/241 (2013.01 - EP KR US)
Citation (search report)
See references of WO 2007118875A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
WO 2007118875 A2 20071025; WO 2007118875 A3 20080807; BR PI0710241 A2 20110809; CA 2649786 A1 20071025; CN 101473072 A 20090701; EP 2010699 A2 20090107; IL 194754 A0 20090803; JP 2009534527 A 20090924; KR 20090009876 A 20090123; RU 2008145108 A 20100527; RU 2420616 C2 20110610; TW 200811316 A 20080301; US 2009101511 A1 20090423
DOCDB simple family (application)
EP 2007053707 W 20070417; BR PI0710241 A 20070417; CA 2649786 A 20070417; CN 200780022645 A 20070417; EP 07728172 A 20070417; IL 19475408 A 20081022; JP 2009505867 A 20070417; KR 20087028157 A 20081118; RU 2008145108 A 20070417; TW 96113679 A 20070418; US 29786407 A 20070417