EP 2010700 B1 20100120 - ELECTROPLATING DEVICE AND METHOD
Title (en)
ELECTROPLATING DEVICE AND METHOD
Title (de)
VORRICHTUNG UND VERFAHREN ZUR GALVANISCHEN BESCHICHTUNG
Title (fr)
PROCÉDÉ ET DISPOSITIF DE REVÊTEMENT GALVANIQUE
Publication
Application
Priority
- EP 2007053401 W 20070405
- EP 06112724 A 20060418
- EP 07727869 A 20070405
Abstract (en)
[origin: WO2007118810A2] The invention relates to a device for electroplating at least one electrically conductive substrate or a structured or electrically conductive surface covering the whole area of a non-conductive substrate. Said device comprises at least one bath, an anode and a cathode. The bath contains an electrolyte solution, which comprises at least one metal salt and from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer, as the cathode is brought into contact with the surface of the substrate to be coated and said substrate is conveyed through the bath. The cathode comprises at least two discs (2, 4, 10) that are rotatably mounted on a respective shaft (1, 5, 14), said discs (2, 4, 10) intermeshing. The invention also relates to a method for electroplating at least one substrate, said method being carried out in a device according to the invention. The invention further relates to the use of said device for electroplating electrically conductive structures situated on an electrically non-conductive support.
IPC 8 full level
C25D 7/06 (2006.01); C25D 7/00 (2006.01); C25D 17/00 (2006.01)
CPC (source: EP KR US)
C25D 7/0657 (2013.01 - EP US); C25D 17/005 (2013.01 - EP US); C25D 17/02 (2013.01 - KR); C25D 17/06 (2013.01 - EP US); C25D 17/10 (2013.01 - KR); C25D 17/12 (2013.01 - EP US); C25D 17/28 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2007118810 A2 20071025; WO 2007118810 A3 20080522; AT E455879 T1 20100215; BR PI0710662 A2 20110816; CA 2647969 A1 20071025; CN 101426962 A 20090506; DE 502007002680 D1 20100311; EP 2010700 A2 20090107; EP 2010700 B1 20100120; IL 194505 A0 20090803; JP 2009534525 A 20090924; KR 20080110658 A 20081218; RU 2008145105 A 20100527; TW 200813263 A 20080316; US 2009178930 A1 20090716
DOCDB simple family (application)
EP 2007053401 W 20070405; AT 07727869 T 20070405; BR PI0710662 A 20070405; CA 2647969 A 20070405; CN 200780014144 A 20070405; DE 502007002680 T 20070405; EP 07727869 A 20070405; IL 19450508 A 20081002; JP 2009505839 A 20070405; KR 20087026807 A 20081031; RU 2008145105 A 20070405; TW 96113680 A 20070418; US 29733007 A 20070405