EP 2014688 B1 20120530 - Thermosensitive adhesive material
Title (en)
Thermosensitive adhesive material
Title (de)
Wärmeempfindliches Haftmaterial
Title (fr)
Matériau adhésif thermosensible
Publication
Application
Priority
JP 2007180258 A 20070709
Abstract (en)
[origin: EP2014688A1] A thermosensitive adhesive material which is superior in blocking resistance when not active and which has adequate adhesion in a wide temperature range to a target with little smoothness such as corrugated fiberboard. Specifically, the thermosensitive adhesive material includes a support, and a thermosensitive adhesive layer provided on one surface of the support, the thermosensitive adhesive layer containing as essential components a thermoplastic resin and a hot-melt material that melts when heated, wherein the thermoplastic resin contains as a main component a (meth)acrylic copolymer in which acrylonitrile, a monomer component, occupies 5% by mass to 20% by mass of all monomer components, and wherein the glass transition temperature of the copolymer is in the range of -70°C to -30°C.
IPC 8 full level
C08F 220/44 (2006.01); B32B 27/30 (2006.01); B41M 5/44 (2006.01); B41M 5/50 (2006.01); B44C 1/10 (2006.01); C08L 9/02 (2006.01); C09J 109/02 (2006.01); G09F 3/02 (2006.01); G09F 3/10 (2006.01)
CPC (source: EP US)
B41M 5/502 (2013.01 - EP US); C08F 220/1804 (2020.02 - EP US); C08F 220/1808 (2020.02 - EP US); C08L 9/02 (2013.01 - EP US); C08L 13/00 (2013.01 - EP US); C08L 51/003 (2013.01 - EP US); C08L 51/04 (2013.01 - EP US); C09J 133/18 (2013.01 - EP US); G03G 7/004 (2013.01 - EP US); G03G 8/00 (2013.01 - EP US); B41M 5/42 (2013.01 - EP US); B41M 5/44 (2013.01 - EP US); B41M 5/504 (2013.01 - EP US); B41M 2205/04 (2013.01 - EP US); B41M 2205/36 (2013.01 - EP US); C08F 212/08 (2013.01 - EP US); C08F 218/08 (2013.01 - EP US); C08F 220/06 (2013.01 - EP US); C08F 220/14 (2013.01 - EP US); C08F 220/44 (2013.01 - EP US); C08F 220/58 (2013.01 - EP US); C08F 222/02 (2013.01 - EP US); C08L 33/08 (2013.01 - EP US); C08L 2666/04 (2013.01 - EP US); Y10T 428/2896 (2015.01 - EP US)
C-Set (source: EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 2014688 A1 20090114; EP 2014688 B1 20120530; CN 101343519 A 20090114; CN 101343519 B 20110518; JP 2009013382 A 20090122; JP 5100223 B2 20121219; US 2009017299 A1 20090115
DOCDB simple family (application)
EP 08159903 A 20080708; CN 200810128133 A 20080707; JP 2007180258 A 20070709; US 17013908 A 20080709