EP 2015870 B1 20091230 - METHOD FOR GROUNDING A HIGH VOLTAGE ELECTRODE
Title (en)
METHOD FOR GROUNDING A HIGH VOLTAGE ELECTRODE
Title (de)
VERFAHREN ZUM ERDEN EINER HOCHSPANNUNGSELEKTRODE
Title (fr)
PROCÉDÉ DE MISE À LA TERRE D'UNE ÉLECTRODE HAUTE TENSION
Publication
Application
Priority
CH 2006000183 W 20060330
Abstract (en)
[origin: WO2007112599A1] The invention relates to an arrangement comprising a high voltage electrode (1) and a process vessel (2) that is associated with said high voltage electrode (1). The high voltage electrode (1) and the process vessel (2) can be placed relative to one another in such a way that the operational end (5) of the high voltage electrode (1) is immersed in the process vessel (2) in an operating position while being disposed outside the process vessel (2) in an off position. The arrangement further comprises a grounding device (3) which is embodied so as to automatically enter in contact with the operational end (5) of the electrode in order to ground the high voltage electrode (1) when the same is placed in the off position. The inventive arrangement makes it possible to create electrodynamic fragmentation systems in which the high voltage electrode (1) is automatically and reliably grounded when the operational end (5) thereof becomes accessible while the grounding can actually be seen, thus significantly improving personnel safety.
IPC 8 full level
B02C 19/18 (2006.01)
CPC (source: EP US)
B02C 19/18 (2013.01 - EP US); B02C 2019/183 (2013.01 - EP US); Y10T 29/49169 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2007112599 A1 20071011; AT E453455 T1 20100115; AU 2006341523 A1 20071011; AU 2006341523 B2 20110310; CA 2645268 A1 20071011; CA 2645268 C 20131231; DE 502006005813 D1 20100211; DK 2015870 T3 20100510; EP 2015870 A1 20090121; EP 2015870 B1 20091230; ES 2337924 T3 20100430; JP 2009531165 A 20090903; JP 4914490 B2 20120411; US 2009236142 A1 20090924; US 8071876 B2 20111206
DOCDB simple family (application)
CH 2006000183 W 20060330; AT 06721892 T 20060330; AU 2006341523 A 20060330; CA 2645268 A 20060330; DE 502006005813 T 20060330; DK 06721892 T 20060330; EP 06721892 A 20060330; ES 06721892 T 20060330; JP 2009501807 A 20060330; US 28277806 A 20060330