EP 2018520 A2 20090128 - SENSOR HOUSING
Title (en)
SENSOR HOUSING
Title (de)
SENSORGEHÄUSE
Title (fr)
BOÎTIER DE CAPTEUR
Publication
Application
Priority
- CH 2007000224 W 20070504
- CH 7792006 A 20060512
Abstract (en)
[origin: WO2007131372A2] The invention relates to a proximity sensor (1) comprising a sensor housing with an outer housing shell (3) and an inner housing shell (15) that is moulded onto the inner wall (7) of the outer shell by injection moulding. A moulded base (17) divides the housing interior into two sub-chambers (19a, 19b). Contact elements (21), which can be used to establish solder-free connections to contact surfaces on a PCB (10), are sunk into said base (7). The front end of the sensor housing is sealed by a welded plastic cap (35). Potting of the sensor housing with a curing casting resin is not required.
IPC 8 full level
G01D 11/24 (2006.01)
CPC (source: EP)
G01D 11/245 (2013.01)
Citation (search report)
See references of WO 2007131372A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
WO 2007131372 A2 20071122; WO 2007131372 A3 20080110; EP 2018520 A2 20090128
DOCDB simple family (application)
CH 2007000224 W 20070504; EP 07720121 A 20070504