EP 2018643 A1 20090128 - INDUCTIVE COMPONENT AND METHOD FOR MANUFACTURING AN INDUCTIVE COMPONENT
Title (en)
INDUCTIVE COMPONENT AND METHOD FOR MANUFACTURING AN INDUCTIVE COMPONENT
Title (de)
INDUKTIVES BAUELEMENT UND VERFAHREN ZUM HERSTELLEN EINES INDUKTIVEN BAUELEMENTS
Title (fr)
COMPOSANT INDUCTIF ET PROCEDE DE REALISATION D'UN COMPOSANT INDUCTIF
Publication
Application
Priority
- EP 2007054285 W 20070503
- DE 102006022785 A 20060516
Abstract (en)
[origin: WO2007131884A1] The invention relates to a method for manufacturing an inductive component that is constructed from multiple layers in which the following steps are performed: a) Arrangement of an electrically conducting material (511 to 514; 521 to 524) as a winding of the component (I, II, III, IV) on a first nonmagnetic dielectric ceramic layer (5; 5a to 5h); b) Construction of at least one continuous recess (53, 53', 53'', 53''') in the nonmagnetic dielectric ceramic layer (5, 5a to 5h); c) Arrangement of a first magnetic ceramic layer (6) on an upper side and of a second magnetic ceramic layer (7) on an underside of the nonmagnetic dielectric ceramic layer (5, 5a to 5h); and d) Performing a process step in which at least one of the magnetic ceramic layers (6, 7) is plastically deformed, in such a way that both the magnetic ceramic layers (6, 7) are contacted in the region of the recess (53, 53', 53'', 53''') and form a magnetic core of the component (I, II, III, IV). The invention also relates to an inductive element of this type.
IPC 8 full level
H01F 41/02 (2006.01)
CPC (source: EP KR US)
H01F 17/0013 (2013.01 - EP US); H01F 17/043 (2013.01 - EP US); H01F 27/2804 (2013.01 - EP US); H01F 41/02 (2013.01 - KR); H01F 41/0233 (2013.01 - EP US); H01F 41/041 (2013.01 - EP US); H01F 1/344 (2013.01 - EP US); H01F 1/348 (2013.01 - EP US); Y10T 29/49073 (2015.01 - EP US)
Citation (search report)
See references of WO 2007131884A1
Designated contracting state (EPC)
DE FR GB HU IT
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
DE 102006022785 A1 20071122; CN 101443863 A 20090527; CN 101443863 B 20120530; DE 502007005763 D1 20110105; EP 2018643 A1 20090128; EP 2018643 B1 20101124; JP 2009537976 A 20091029; JP 4971432 B2 20120711; KR 101433838 B1 20140827; KR 20090015975 A 20090212; TW 200802436 A 20080101; US 2009102591 A1 20090423; US 7973631 B2 20110705; WO 2007131884 A1 20071122
DOCDB simple family (application)
DE 102006022785 A 20060516; CN 200780017706 A 20070503; DE 502007005763 T 20070503; EP 07728738 A 20070503; EP 2007054285 W 20070503; JP 2009510399 A 20070503; KR 20087030628 A 20070503; TW 96116383 A 20070509; US 30090907 A 20070503