EP 2020026 A2 20090204 - INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS
Title (en)
INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS
Title (de)
INTEGRIERTE SCHALTUNG MIT KONTAKTSTELLEN UND EIN-/AUSGABEZELLEN
Title (fr)
CIRCUIT INTÉGRÉ POSSÉDANT DES PLAGES D'INTERCONNEXION ET DES CELLULES D'ENTRÉE/SORTIE (E/S)
Publication
Application
Priority
- US 2007065619 W 20070330
- US 38365606 A 20060516
- US 38365306 A 20060516
Abstract (en)
[origin: WO2007136932A2] A pad (20) is electrically connected to a first I/O cell (14) while also physically overlying active circuitry of a second I/O cell (16). Note that although the pad (20) overlies the second I/O cell (16), the pad (20) is not electrically connected to the I/O cell (16). Such a pattern may be replicated in any desired manner so that the I/O cells (e.g. 300-310) may have a finer pitch than the corresponding pads (320-324 and 330-335). In addition, the size of the pads may be increased (e.g. pad 131 may be bigger than pad 130) while the width "c" of the I/O cells (132-135) does not have to be increased. Such a pattern (e.g. 500) may be arranged so that the area required in one or more dimensions may be minimized.
IPC 8 full level
H01L 23/485 (2006.01); H01L 23/52 (2006.01); H01L 27/02 (2006.01)
CPC (source: EP KR)
H01L 21/82 (2013.01 - KR); H01L 24/05 (2013.01 - EP); H01L 24/06 (2013.01 - EP); H01L 27/0203 (2013.01 - EP); H01L 2224/02166 (2013.01 - EP); H01L 2224/04042 (2013.01 - EP); H01L 2224/05082 (2013.01 - EP); H01L 2224/05083 (2013.01 - EP); H01L 2224/05147 (2013.01 - EP); H01L 2224/05181 (2013.01 - EP); H01L 2224/05552 (2013.01 - EP); H01L 2224/05624 (2013.01 - EP); H01L 2224/05644 (2013.01 - EP); H01L 2224/05647 (2013.01 - EP); H01L 2224/06051 (2013.01 - EP); H01L 2224/06153 (2013.01 - EP); H01L 2224/06159 (2013.01 - EP); H01L 2224/48463 (2013.01 - EP); H01L 2224/49431 (2013.01 - EP); H01L 2924/00014 (2013.01 - EP); H01L 2924/01005 (2013.01 - EP); H01L 2924/01006 (2013.01 - EP); H01L 2924/01013 (2013.01 - EP); H01L 2924/01015 (2013.01 - EP); H01L 2924/01029 (2013.01 - EP); H01L 2924/01033 (2013.01 - EP); H01L 2924/01047 (2013.01 - EP); H01L 2924/01073 (2013.01 - EP); H01L 2924/01079 (2013.01 - EP); H01L 2924/1306 (2013.01 - EP); H01L 2924/14 (2013.01 - EP)
Designated contracting state (EPC)
DE FR GB IT NL
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
WO 2007136932 A2 20071129; WO 2007136932 A3 20090326; EP 2020026 A2 20090204; EP 2020026 A4 20100609; JP 2009537988 A 20091029; KR 20090025239 A 20090310
DOCDB simple family (application)
US 2007065619 W 20070330; EP 07759809 A 20070330; JP 2009511129 A 20070330; KR 20087030486 A 20081215