EP 2020027 A2 20090204 - STRUCTURE AND METHOD FOR CREATING RELIABLE VIA CONTACTS FOR INTERCONNECT APPLICATIONS
Title (en)
STRUCTURE AND METHOD FOR CREATING RELIABLE VIA CONTACTS FOR INTERCONNECT APPLICATIONS
Title (de)
STRUKTUR UND VERFAHREN ZUR ERZEUGUNG ZUVERLÄSSIGER PFADKONTAKTE FÜR VERBINDUNGSANWENDUNGEN
Title (fr)
STRUCTURE ET PROCÉDÉ PERMETTANT DE CRÉER DES CONTACTS DE TRAVERSÉES FIABLES POUR DES APPLICATIONS D'INTERCONNEXION
Publication
Application
Priority
- US 2007011437 W 20070511
- US 43541006 A 20060517
Abstract (en)
[origin: US2007267751A1] A reliable and mechanical strong interconnect structure is provided that does not include gouging features in the bottom of the an opening, particularly at a via bottom. Instead, the interconnect structures of the present invention utilize a Co-containing buffer layer that is selectively deposited on exposed surfaces of the conductive features that are located in a lower interconnect level. The selective deposition is performed through at least one opening that is present in a dielectric material of an upper interconnect level. The selective deposition is performed by electroplating or electroless plating. The Co-containing buffer layer comprises Co and at least one of P and B. W may optionally be also present in the Co-containing buffer layer.
IPC 8 full level
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01)
CPC (source: EP US)
H01L 21/288 (2013.01 - EP US); H01L 21/76814 (2013.01 - EP US); H01L 21/76816 (2013.01 - EP US); H01L 21/76834 (2013.01 - EP US); H01L 21/76843 (2013.01 - EP US); H01L 21/76846 (2013.01 - EP US); H01L 21/76852 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
US 2007267751 A1 20071122; US 7800228 B2 20100921; CN 101438404 A 20090520; CN 101438404 B 20110504; EP 2020027 A2 20090204; EP 2020027 A4 20101201; EP 2020027 B1 20140903; TW 200818391 A 20080416; TW I406361 B 20130821; US 2009298280 A1 20091203; US 7960274 B2 20110614; WO 2008069832 A2 20080612; WO 2008069832 A3 20081030
DOCDB simple family (application)
US 43541006 A 20060517; CN 200780015989 A 20070511; EP 07870667 A 20070511; TW 96116070 A 20070507; US 2007011437 W 20070511; US 53877209 A 20090810