EP 2023388 A2 20090211 - Semiconductor package
Title (en)
Semiconductor package
Title (de)
Halbleiterpaket
Title (fr)
Conditionnement de semi-conducteur
Publication
Application
Priority
JP 2007205846 A 20070807
Abstract (en)
A semiconductor package (10) includes a base plate (12) having first and second surfaces (12a and 12b) both facing in opposite directions, and a plurality of anisotropic heat conducting members (22) disposed in the base plate and spaced away from each other. A semiconductor element (14) having a heat generating unit (14a) is mounted on the first surface, and the second surface is supported on a supporting member having a thermal conductivity. Each anisotropic heat conducting member has a sheet shape intersecting with the first and second surfaces, and orientates a direction of higher thermal conductivity than the thermal conductivity of the base plate in a direction from the first surface toward the second surface.
IPC 8 full level
H01L 23/367 (2006.01); H01L 23/373 (2006.01)
CPC (source: EP US)
H01L 23/3677 (2013.01 - EP US); H01L 23/3733 (2013.01 - EP US); H01L 23/3735 (2013.01 - EP US); H01L 23/373 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
Citation (applicant)
JP 2004288949 A 20041014 - KYOCERA CORP
Designated contracting state (EPC)
DE FR GB
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
EP 2023388 A2 20090211; EP 2023388 A3 20091111; EP 2023388 B1 20110209; DE 602008004858 D1 20110324; JP 2009043851 A 20090226; JP 4504401 B2 20100714; US 2009039500 A1 20090212; US 7868450 B2 20110111
DOCDB simple family (application)
EP 08252629 A 20080805; DE 602008004858 T 20080805; JP 2007205846 A 20070807; US 18612908 A 20080805