EP 2024136 A2 20090218 - WAFER DE-CHUCKING
Title (en)
WAFER DE-CHUCKING
Title (de)
LÖSEN VON WAFERN
Title (fr)
DE-CHUCKING DE PLAQUETTE
Publication
Application
Priority
- IB 2007051599 W 20070430
- EP 06300423 A 20060502
- EP 07735709 A 20070430
Abstract (en)
[origin: WO2007125511A2] A carrier head (100) for a CMP tool, wherein the membrane (108) defining a chamber with a contact surface (102) of the carrier head (100) has a number of integral tubes (110) termining in openings coupled directly to the substrate (106), in addition to a main fluid flow passage (104) coupled to the chamber defined by the membrane (108). In use, during loading and polishing, a vacuum is applied to the main fluid flow passage (104) and the tubes (110) to hold the substrate (106) in flat engagement with the membrane (108) and contact surface (102). In order to unload the substrate (106), fluid pressure is applied to the substrate (106) via the tubes (110), whilst maintaining the application of the vacuum via the main fluid flow passage (104) so as to minimise bending and breakage of the substrate (106).
IPC 8 full level
B24B 37/30 (2012.01)
CPC (source: EP US)
B24B 37/30 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
WO 2007125511 A2 20071108; WO 2007125511 A3 20080221; CN 101484277 A 20090715; EP 2024136 A2 20090218; JP 2009535836 A 20091001; US 2009186560 A1 20090723
DOCDB simple family (application)
IB 2007051599 W 20070430; CN 200780025154 A 20070430; EP 07735709 A 20070430; JP 2009508596 A 20070430; US 29930207 A 20070430