GPI coverage and content

You can use Global Patent Index (GPI) to carry out detailed searches in the EPO's worldwide bibliographic (DOCDB), legal event (INPADOC) and full-text data sets, and download or visualise the search results for statistical analysis.

Current content: 155 263 406 patent documents

This week's update (19/04/2024 12:00 CET):

215 613 new documents added

1 342 057 documents amended

GPI key values

Run regular monitoring (e.g. monthly or quarterly) of technical areas or companies

Use built-in charts to visualise technical trends and patenting activity of companies

Choose the data you want to see and download to focus on what you are interested in

Run data quality assessments to measure the risk of incomplete search results

EP 2024415 A1 20090218 - ELECTRONIC MOLDING COMPOSITION AND METHOD

Title (en)

ELECTRONIC MOLDING COMPOSITION AND METHOD

Title (de)

ELEKTRONIKFORMMASSE UND -VERFAHREN

Title (fr)

COMPOSITION ET PROCÉDÉ DE MOULAGE ÉLECTRONIQUE

Publication

EP 2024415 A1 20090218 (EN)

Application

EP 06759418 A 20060510

Priority

US 2006017952 W 20060510

Abstract (en)

[origin: WO2007130063A1] A curable molding composition is provided having a binder system and a filler system. The molding composition is useful as an electronic material composition for electronic devices.

IPC 8 full level

C08G 65/48 (2006.01); C08K 9/06 (2006.01)

CPC (source: EP)

C08G 65/485 (2013.01); C08L 71/126 (2013.01); C08G 2650/04 (2013.01); C08K 9/06 (2013.01)

Citation (search report)

See references of WO 2007130063A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA HR MK YU

DOCDB simple family (publication)

WO 2007130063 A1 20071115; EP 2024415 A1 20090218

DOCDB simple family (application)

US 2006017952 W 20060510; EP 06759418 A 20060510