Global Patent Index - EP 2026957 A2

EP 2026957 A2 20090225 - CHILD-RESISTANT BLISTER PACKAGE

Title (en)

CHILD-RESISTANT BLISTER PACKAGE

Title (de)

KINDERSICHERE BLISTERPACKUNG

Title (fr)

EMBALLAGE MOULÉ RÉSISTANT AUX ENFANTS

Publication

EP 2026957 A2 20090225 (EN)

Application

EP 07796123 A 20070612

Priority

  • US 2007013977 W 20070612
  • US 45109506 A 20060612

Abstract (en)

[origin: US2007284280A1] An improved child-resistant blister package is provided in which the lidding component includes a tear-resistant nonwoven layer and a barrier layer. The nonwoven layer can be a melt-spun continuous filament nonwoven web. The lidding component used in peel off-push through blister packages of the invention contains fewer layers, can be processed at higher blister package sealing temperatures and has improved puncture resistance compared to lidding components used in child-resistant packages known in the art. In addition, in peel off-push through and peel-open package designs of the present invention, the lidding peels more cleanly from the blister component compared to packages known in the art which have a tendency to tear during peeling.

IPC 8 full level

B32B 3/28 (2006.01); B32B 27/12 (2006.01); B65D 75/34 (2006.01); B65D 75/36 (2006.01)

CPC (source: EP US)

B32B 27/12 (2013.01 - EP US); B65D 75/327 (2013.01 - EP US); B65D 2215/00 (2013.01 - EP US)

Citation (search report)

See references of WO 2007146392A2

Designated contracting state (EPC)

DE FR GB

Designated extension state (EPC)

AL BA HR MK RS

DOCDB simple family (publication)

US 2007284280 A1 20071213; CN 101466532 A 20090624; EP 2026957 A2 20090225; WO 2007146392 A2 20071221; WO 2007146392 A3 20080214

DOCDB simple family (application)

US 45109506 A 20060612; CN 200780021619 A 20070612; EP 07796123 A 20070612; US 2007013977 W 20070612