Title (en)

SPUTTER TARGET WITH SPUTTER MATERIAL BASED ON TIO2, AND A PRODUCTION METHOD

Title (de)

SPUTTERTARGET MIT EINEM SPUTTERMATERIAL AUF BASIS TIO2 SOWIE HERSTELLVERFAHREN

Title (fr)

CIBLE DE PULVÉRISATION AVEC UN MATÉRIAU DE PULVÉRISATION À BASE DE TIO2 AINSI QUE PROCÉDÉ DE FABRICATION

Publication

EP 2027302 A1 20090225 (DE)

Application

EP 07725867 A 20070606

Priority

• EP 2007005010 W 20070606
• DE 102006027029 A 20060609

Abstract (en)

[origin: WO2007141003A1] The invention relates to a sputter target, with sputter material based on TiO<SUB>2</SUB> which has 15-60 mol % of Nb<SUB>2</SUB>0s. The invention further relates to a method for the production of a sputter target consisting of the following steps: - mixture of TiO<SUB>2</SUB> and Nb<SUB>2</SUB>O<SUB>5</SUB> powder in liquid slurry - spraying of this slurry to cause the TiO<SUB>2</SUB>-Nb<SUB>2</SUB>O<SUB>5</SUB> mixed oxide mixture to granulate - plasma spraying of this granulated mixture onto the base body of a sputter target.

IPC 8 full level

C23C 14/34 (2006.01)

CPC (source: EP US)

C04B 35/46 (2013.01 - EP US); C04B 35/462 (2013.01 - EP US); C04B 35/495 (2013.01 - EP US); C04B 35/62695 (2013.01 - EP US); C23C 14/3414 (2013.01 - EP US); C04B 2235/3232 (2013.01 - EP US); C04B 2235/3251 (2013.01 - EP US); C04B 2235/3286 (2013.01 - EP US); C04B 2235/786 (2013.01 - EP US)

Citation (search report)

See references of WO 2007141003A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

Designated extension state (EPC)

AL BA HR MK RS

DOCDB simple family (publication)

DE 102006027029 A1 20071213; DE 102006027029 B4 20100930; CN 101460652 A 20090617; EP 2027302 A1 20090225; JP 2009540112 A 20091119; US 2009183987 A1 20090723; WO 2007141003 A1 20071213

DOCDB simple family (application)

DE 102006027029 A 20060609; CN 200780021039 A 20070606; EP 07725867 A 20070606; EP 2007005010 W 20070606; JP 2009513595 A 20070606; US 30230207 A 20070606