EP 2027759 B1 20100106 - DEVICE FOR SOLDERING IN THE VAPOUR PHASE
Title (en)
DEVICE FOR SOLDERING IN THE VAPOUR PHASE
Title (de)
VORRICHTUNG ZUM LÖTEN IN DER DAMPFPHASE
Title (fr)
DISPOSITIF POUR BRASER EN PHASE VAPEUR
Publication
Application
Priority
- EP 2007004744 W 20070529
- DE 102006025184 A 20060530
Abstract (en)
[origin: US2010170940A1] The application describes a soldering device comprising a soldering chamber for receiving a liquid and having a soldering chamber opening, an intermediate chamber arranged at the soldering chamber opening and having a substrate changing opening for supplying and removing items to be soldered, and a closure device for opening and closing the soldering chamber opening and the substrate changing opening. The closure device is designed as a unit such that, when the substrate changing opening is being closed, the soldering chamber opening is opened at the same time and vice versa. This soldering device is cost-effective in both production and operation.
IPC 8 full level
CPC (source: EP US)
B23K 1/015 (2013.01 - EP US); H05K 3/3494 (2013.01 - EP US)
Designated contracting state (EPC)
AT CH DE FR GB LI
DOCDB simple family (publication)
US 2010170940 A1 20100708; AT E454808 T1 20100115; DE 102006025184 A1 20071206; DE 102006025184 B4 20080221; DE 502007002568 D1 20100225; EP 2027759 A1 20090225; EP 2027759 B1 20100106; WO 2007137817 A1 20071206
DOCDB simple family (application)
US 22755307 A 20070529; AT 07725635 T 20070529; DE 102006025184 A 20060530; DE 502007002568 T 20070529; EP 07725635 A 20070529; EP 2007004744 W 20070529