EP 2027979 B1 20130306 - Method for manufacturing conductive wood material boards and same
Title (en)
Method for manufacturing conductive wood material boards and same
Title (de)
Verfahren zur Herstellung von leitfähigen Holzwerkstoffplatten und solche Holzwerkstoffplatten
Title (fr)
Procédé de fabrication de plaques en bois conductrices et de telles plaques en bois conductrices
Publication
Application
Priority
DE 102007039267 A 20070820
Abstract (en)
[origin: EP2027979A1] The method involves providing a preform with a main portion of lignocellulose containing fibers, chips and strands mixed with an adhesive, and hot pressing a conductive wood material board i.e. medium density fiberboard. The hot-pressed wood material board is powder-coated. The adhesive is made of a phenol-formaldehyde adhesive and a low molecular protein-containing component e.g. wheat protein-containing component, for increasing the conductivity of the wood material board. An alkali, earth alkali or ammonium salt is utilized.
IPC 8 full level
CPC (source: EP)
B27N 3/00 (2013.01); B27N 3/002 (2013.01); B27N 7/005 (2013.01)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 2027979 A1 20090225; EP 2027979 B1 20130306; DE 102007039267 A1 20090226; DE 102007039267 B4 20130404; ES 2405315 T3 20130530; PL 2027979 T3 20130731
DOCDB simple family (application)
EP 08014789 A 20080820; DE 102007039267 A 20070820; ES 08014789 T 20080820; PL 08014789 T 20080820