EP 2029475 A1 20090304 - MANUFACTURING METHOD OF MICROSTRUCTURE AND MICROMACHINE
Title (en)
MANUFACTURING METHOD OF MICROSTRUCTURE AND MICROMACHINE
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER MIKROSTRUKTUR UND EINER MIKROMASCHINE
Title (fr)
MÉTHODE DE FABRICATION DE MICROSTRUCTURE ET DE MICROMACHINE
Publication
Application
Priority
- JP 2007059823 W 20070508
- JP 2006138835 A 20060518
Abstract (en)
[origin: WO2007135878A1] Without sacrificial layer etching, a microstructure and a micromachine are manufactured. A separation layer 102 is formed over a substrate 101, and a layer 103 to be a movable electrode is formed over the separation layer 102. At an interface of the separation layer 102, the layer 103 to be a movable electrode is separated from the substrate. A layer 106 to be a fixed electrode is formed over another substrate 105. The layer 103 to be a movable electrode is fixed to the substrate 105 with the spacer layer 103 which is partially provided interposed therebetween, so that the layer 103 to be a movable electrode and a layer 106 to be a fixed electrode face each other.
IPC 8 full level
B81C 3/00 (2006.01)
CPC (source: EP KR US)
B32B 38/10 (2013.01 - KR US); B81C 3/008 (2013.01 - EP KR US); H01L 21/762 (2013.01 - KR US); B81C 2201/019 (2013.01 - EP KR US); Y10T 428/24802 (2015.01 - EP US)
Designated contracting state (EPC)
DE FI FR GB NL
Designated extension state (EPC)
AL BA HR MK RS
DOCDB simple family (publication)
WO 2007135878 A1 20071129; CN 101405215 A 20090408; CN 101405215 B 20130109; EP 2029475 A1 20090304; EP 2029475 A4 20140806; EP 2029475 B1 20161012; KR 101416512 B1 20140708; KR 20090014142 A 20090206; US 2008176046 A1 20080724; US 2012171843 A1 20120705; US 2014262000 A1 20140918; US 8138560 B2 20120320; US 8741682 B2 20140603; US 9130012 B2 20150908
DOCDB simple family (application)
JP 2007059823 W 20070508; CN 200780009662 A 20070508; EP 07743258 A 20070508; KR 20087023327 A 20070508; US 201213414758 A 20120308; US 201414289748 A 20140529; US 74818307 A 20070514